仕様
| 属性 | 値 |
| Supplier | Lattice Semiconductor Corporation |
| Package / Case | Tray |
| Series | XP2 |
| Part Status | Active |
| Number of LABs/CLBs | 2125 |
| Number of Logic Elements/Cells | 17000 |
| Total RAM Bits | 282624 |
| Number of I/O | 201 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概要
Description
LFXP2-17E-5FTN256I is a Lattice XP2-series FPGA in a 256-pin Fine-PQFP package. The name indicates: XP2 family, about 17k logic elements (LEs), speed grade -5, FTN256 package, Industrial temperature range (I). It provides configurable logic (LUTs and flip-flops), I/O banks, small RAM blocks, and routing for digital designs. It targets cost-sensitive, mid-density applications needing glue logic, state machines, simple controllers, and interface logic, with support for common HDL flows (Verilog/VHDL). The device is industrial-temperature rated for moderate power and performance environments, and offers multiple I/O standards across banks and scalable clocking. It’s suitable for embedded control, interface adapters, and other practical mid-range FPGA tasks. For exact specifications (LE count, RAM, I/O counts, speed, power), consult the official datasheet and package matrix.
Features
Here are concise features for LFXP2-17E-5FTN256I:
- FPGA: LFXP2 XP2 family device with about 17K logic elements (LEs)
- Package: 256-pin FineLine BGA (FTN256I)
- Speed grade: -5
- Temperature: Industrial range, typically -40°C to 85°C
- Logic & memory: LUT-based logic, on-chip block RAM and distributed RAM
- Clocking: built-in PLLs/clock management resources
- I/O: multiple banks with diverse I/O standards (LVTTL/LVCMOS, 3.3V/2.5V tolerant, etc.)
- Configuration: supports standard FPGA config interfaces (external serial/parallel configurations via vendor tools)
- Development tools: supported by Lattice Diamond/ispLEVER toolchains
Note: exact I/O counts, RAM size, and supported standards depend on package and device configuration; consult the datasheet for precise specs.
- FPGA: LFXP2 XP2 family device with about 17K logic elements (LEs)
- Package: 256-pin FineLine BGA (FTN256I)
- Speed grade: -5
- Temperature: Industrial range, typically -40°C to 85°C
- Logic & memory: LUT-based logic, on-chip block RAM and distributed RAM
- Clocking: built-in PLLs/clock management resources
- I/O: multiple banks with diverse I/O standards (LVTTL/LVCMOS, 3.3V/2.5V tolerant, etc.)
- Configuration: supports standard FPGA config interfaces (external serial/parallel configurations via vendor tools)
- Development tools: supported by Lattice Diamond/ispLEVER toolchains
Note: exact I/O counts, RAM size, and supported standards depend on package and device configuration; consult the datasheet for precise specs.
Pinout
- Pin count: 256 pins (FTN256I package)
- Function: Lattice LFXP2-series FPGA (approximately 17K logic elements) for general-purpose, small-to-medium size FPGA designs (industrial temperature range).
- Function: Lattice LFXP2-series FPGA (approximately 17K logic elements) for general-purpose, small-to-medium size FPGA designs (industrial temperature range).
Manufacturer
- Manufacturer: Lattice Semiconductor Corporation (Lattice).
- What kind of company: A fabless semiconductor company that designs and markets programmable logic devices (FPGAs, CPLDs) and related IP, with manufacturing outsourced to foundries.
- What kind of company: A fabless semiconductor company that designs and markets programmable logic devices (FPGAs, CPLDs) and related IP, with manufacturing outsourced to foundries.
Application
Typical application areas for LFXP2-17E-5FTN256I include:
- Industrial automation and control (PLC I/O, sensors, motor drive)
- Embedded systems and glue logic (MCU interfacing, state machines)
- Digital signal processing and data acquisition
- Communications interfaces and protocol bridging
- Consumer electronics, appliances, LED driver control
- Test, measurement, and instrumentation equipment
- Prototyping, development boards and education kits
The 256-pin FTN package provides abundant, flexible I/O for compact board designs.
- Industrial automation and control (PLC I/O, sensors, motor drive)
- Embedded systems and glue logic (MCU interfacing, state machines)
- Digital signal processing and data acquisition
- Communications interfaces and protocol bridging
- Consumer electronics, appliances, LED driver control
- Test, measurement, and instrumentation equipment
- Prototyping, development boards and education kits
The 256-pin FTN package provides abundant, flexible I/O for compact board designs.
Package
FTN256 denotes a 256-pin Fine-P pitch Ball Grid Array package. So LFXP2-17E-5FTN256I uses a 256-ball FBGA-style package (industrial temperature rating).
