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LFXP2-30E-5FTN256C
+BOMIC FPGA 201 I/O 256FTBGA
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メーカーラティス・セミコンダクター・コーポレーション
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メーカー品番 #LFXP2-30E-5FTN256C
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データシート LFXP2-30E-5FTN256C DataSheet
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在庫状況7179
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | XP2 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 29000 |
| Total RAM Bits | 396288 |
| Number of I/O | 201 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | LFXP2-30 |
| Number of LA Bs / CL Bs | 3625 |
概要
Description
Key characteristics include low power consumption and non-volatile configuration memory, allowing it to retain configuration data without external storage. It operates at a typical voltage of 1.2V and is tailored for applications that require reliable performance with moderate resource requirements, such as consumer electronics, industrial automation, and communications.
The device supports advanced features like embedded block RAM, DSP capabilities, and high-speed DDR memory interfaces. Lattice's design software, Lattice Diamond, is typically used for configuring and programming the LFXP2-30E-5FTN256C, enabling designers to implement custom logic tailored to specific application needs efficiently.
Equivalent
Features
1. Logic Density and Size: It offers approximately 30K Look-Up Tables (LUTs), suitable for moderate complexity designs.
2. Embedded RAM: Includes 885 Kbits of RAM, aiding in data storage and processing.
3. I/O Configuration: Provides up to 201 I/O pins, supporting various voltage standards for flexible board design.
4. Non-volatile Technology: Utilizes Flash-based technology ensuring data retention even without power, combining SRAM and Flash for efficient configuration.
5. Speed: Rated at a speed grade of -5, indicating a balanced trade-off between speed and power consumption.
6. Package Type: Comes in a 256-pin Fine Pitch Thin Non-leaded (FTN) package, optimizing space efficiency.
7. Power Efficiency: Designed to minimize power usage, enhancing battery life in portable applications.
8. Security Features: Includes design security features to protect intellectual property.
These features make it suitable for applications requiring a blend of performance, low power, and non-volatility.
Manufacturer
Application
1. Consumer Electronics: Enhancements for audio, video, and connectivity features.
2. Industrial Automation: Control systems and human-machine interfaces (HMIs).
3. Communications: Signal processing and protocol bridging.
4. Medical Devices: Imaging and diagnostic equipment.
5. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
6. Security and Surveillance: Image processing and data encryption.
Its low power consumption and small form factor make it ideal for portable and battery-operated devices.