仕様
| 属性 | 値 |
| Package | Tray |
| ProductStatus | Obsolete |
| CoreProcessor | ARM® Cortex®-M3 |
| CoreSize | 32-Bit |
| Speed | 180MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT |
| NumberofI/O | 164 |
| ProgramMemoryType | ROMless |
| RAMSize | 200K x 8 |
| Voltage-Supply(Vcc/Vdd) | 2.2V ~ 3.6V |
| DataConverters | A/D 8x10bSAR; D/A 1x10b |
| OscillatorType | Internal |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 256-LBGA |
概要
Description
The LPC1830FET256 is a microcontroller from NXP's LPC1800 series, designed for high-performance applications. It is built on an ARM Cortex-M3 processor core, offering a balanced blend of performance and efficiency. The LPC1830 is equipped with various features such as up to 204 MHz CPU frequency, large on-chip SRAM, and multiple high-speed interfaces, making it suitable for complex embedded applications.
Key features include:
- 256 KB flash memory and up to 200 KB SRAM.
- Multiple connectivity options such as USB, UART, SPI, I2C, and Ethernet, providing flexibility for diverse application requirements.
- Advanced peripherals like ADCs and DACs for analog signal processing.
- Low power consumption modes for energy-efficient operation in battery-powered devices.
The LPC1830FET256 is housed in a 256-pin TFBGA package, facilitating advanced designs in industrial control, consumer electronics, and communication devices. Its robust architecture and extensive peripheral set make it ideal for designers seeking high performance with versatile connectivity options.
Key features include:
- 256 KB flash memory and up to 200 KB SRAM.
- Multiple connectivity options such as USB, UART, SPI, I2C, and Ethernet, providing flexibility for diverse application requirements.
- Advanced peripherals like ADCs and DACs for analog signal processing.
- Low power consumption modes for energy-efficient operation in battery-powered devices.
The LPC1830FET256 is housed in a 256-pin TFBGA package, facilitating advanced designs in industrial control, consumer electronics, and communication devices. Its robust architecture and extensive peripheral set make it ideal for designers seeking high performance with versatile connectivity options.
Equivalent
The LPC1830FET256 is a microcontroller from NXP's LPC1800 series. Equivalent products can be other ARM Cortex-M3 microcontrollers with similar features like those from STMicroelectronics' STM32F2 series, Texas Instruments' TM4C123 series, or Microchip's ATSAM3X series. When choosing an equivalent, ensure similar specifications in terms of clock speed, memory, peripherals, and pin count.
Features
The LPC1830FET256 is a microcontroller from NXP Semiconductors, designed for high-performance applications. Key features include:
1. ARM Cortex-M3 Core: Operates at up to 180 MHz, providing robust performance for complex tasks.
2. Memory: Includes up to 200 KB SRAM and supports external memory interfaces for expanded storage capabilities.
3. Connectivity: Offers a wide array of connectivity options including USB 2.0 (both Host and Device), Ethernet, CAN, and multiple UARTs, SPI, and I2C interfaces.
4. Timers and PWM: Equipped with multiple timers and PWM outputs for precise control applications.
5. Analog Features: Contains a 10-bit ADC and DAC for analog signal processing.
6. Security: Provides enhanced security features such as secure boot and cryptographic accelerators.
7. Flexible I/O Configuration: Features a large number of general-purpose I/O pins that can be configured for various functions.
8. Power Management: Supports low-power modes to optimize energy consumption.
These features make the LPC1830FET256 suitable for a wide range of applications, from industrial automation to consumer electronics.
1. ARM Cortex-M3 Core: Operates at up to 180 MHz, providing robust performance for complex tasks.
2. Memory: Includes up to 200 KB SRAM and supports external memory interfaces for expanded storage capabilities.
3. Connectivity: Offers a wide array of connectivity options including USB 2.0 (both Host and Device), Ethernet, CAN, and multiple UARTs, SPI, and I2C interfaces.
4. Timers and PWM: Equipped with multiple timers and PWM outputs for precise control applications.
5. Analog Features: Contains a 10-bit ADC and DAC for analog signal processing.
6. Security: Provides enhanced security features such as secure boot and cryptographic accelerators.
7. Flexible I/O Configuration: Features a large number of general-purpose I/O pins that can be configured for various functions.
8. Power Management: Supports low-power modes to optimize energy consumption.
These features make the LPC1830FET256 suitable for a wide range of applications, from industrial automation to consumer electronics.
Pinout
The LPC1830FET256 is a microcontroller from NXP's LPC1800 series, designed for high-performance applications. It is housed in a TFBGA256 package, which consists of 256 pins. This microcontroller is built around the ARM Cortex-M3 core, operating at frequencies up to 180 MHz, making it suitable for intensive computing tasks.
The LPC1830FET256 features a wide range of functionalities, including:
1. Memory: It includes up to 200 KB of SRAM and supports external memory interfaces like SDRAM and SRAM.
2. Connectivity: It offers multiple communication interfaces such as USB (both Host and Device), Ethernet, SPI, I2C, and USART, making it versatile for various peripheral connections.
3. Timers and PWM: It has multiple general-purpose timers and PWM channels for precise control in applications like motor control.
4. ADC/DAC: The device includes ADC and DAC modules for analog signal processing.
5. Security: It integrates security features such as secure boot and hardware cryptographic accelerators.
This combination of features makes the LPC1830FET256 suitable for applications in industrial automation, consumer electronics, and communication systems.
The LPC1830FET256 features a wide range of functionalities, including:
1. Memory: It includes up to 200 KB of SRAM and supports external memory interfaces like SDRAM and SRAM.
2. Connectivity: It offers multiple communication interfaces such as USB (both Host and Device), Ethernet, SPI, I2C, and USART, making it versatile for various peripheral connections.
3. Timers and PWM: It has multiple general-purpose timers and PWM channels for precise control in applications like motor control.
4. ADC/DAC: The device includes ADC and DAC modules for analog signal processing.
5. Security: It integrates security features such as secure boot and hardware cryptographic accelerators.
This combination of features makes the LPC1830FET256 suitable for applications in industrial automation, consumer electronics, and communication systems.
Manufacturer
The LPC1830FET256 is manufactured by NXP Semiconductors. NXP is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in the design and production of a wide range of semiconductor products, including microcontrollers, processors, and various other integrated circuits for applications in automotive, industrial, consumer, and communication markets. NXP is known for its innovations in secure connectivity solutions for embedded applications and has a significant presence in the automotive and IoT sectors.
Application
The LPC1830FET256 microcontroller from NXP is well-suited for a variety of applications due to its high-performance ARM Cortex-M3 core. It is commonly used in industrial automation, consumer electronics, and communication systems. Its features—including high-speed USB, Ethernet, and advanced peripherals—make it ideal for embedded systems requiring connectivity and real-time processing. Additionally, its low power consumption and robust security features make it suitable for Internet of Things (IoT) devices, smart home applications, and energy-efficient systems. The controller's flexible memory architecture and extensive connectivity options also support applications in data acquisition and digital signal processing.
Package
The LPC1830FET256 is housed in a TFBGA256 package, which stands for Thin Fine-Pitch Ball Grid Array with 256 balls. This package type is compact and suitable for high-density, surface-mounted applications, offering a small footprint for the LPC1830 microcontroller.
