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LSM9DS1
+BOMIMUs - Inertial Measurement Units iNEMO inertial module:3D accelerometer, 3D gyroscope, 3D magnetometer
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メーカーRFE/フューゼテック
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メーカー品番 #LSM9DS1
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在庫状況12802
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
概要
Description
The accelerometer measures linear acceleration, the gyroscope measures angular velocity, and the magnetometer measures the magnetic field, allowing the LSM9DS1 to provide comprehensive motion and orientation data. It communicates via I2C or SPI interfaces, making it compatible with various microcontrollers and development platforms.
Key features include a wide range of selectable full scales, low power consumption, and high data rates, enabling efficient and accurate performance in dynamic environments. It also supports advanced features like FIFO buffering, interrupt generation, and various power modes to optimize functionality and energy efficiency.
Overall, the LSM9DS1 is a robust and cost-effective solution for applications demanding precise motion tracking and orientation sensing, facilitating enhanced user experiences in a compact form factor.
Equivalent
1. InvenSense MPU-9250 - A 9-axis IMU with similar functionality.
2. Bosch BNO055 - An intelligent 9-axis sensor with an integrated sensor fusion algorithm.
3. STMicroelectronics LSM6DSO32 - A 6-axis IMU that can be paired with a separate magnetometer, such as the LIS3MDL, to achieve similar functionality.
These alternatives vary in features like power consumption and sensor accuracy.
Features
1. Accelerometer: Measures linear acceleration with selectable ranges of ±2g, ±4g, ±8g, and ±16g.
2. Gyroscope: Measures angular rate with selectable ranges of ±245, ±500, and ±2000 degrees per second.
3. Magnetometer: Measures magnetic field strength with selectable ranges of ±4, ±8, ±12, and ±16 gauss.
4. Sensor Fusion: Enables 9-axis sensor fusion for comprehensive motion sensing.
5. I2C and SPI Interfaces: Supports communication via both I2C and SPI for easy integration with microcontrollers.
6. Low Power Consumption: Designed to be energy-efficient, suitable for battery-powered applications.
7. Embedded FIFO: Includes a 32-level FIFO buffer to reduce host processor load.
8. Temperature Sensor: Provides temperature data for environmental monitoring.
9. Compact Size: Small form factor, suitable for portable and embedded systems.
These features make the LSM9DS1 suitable for a variety of applications, including drones, smartphones, and wearable devices.
Pinout
1. VDD/VDDIO: Power supply pins for the main supply and I/O.
2. GND: Ground pins.
3. SCL: Serial clock line for I²C interface.
4. SDA: Serial data line for I²C interface.
5. CS_AG, CS_M: Chip select pins for SPI interfaces, one for accelerometer/gyroscope and one for magnetometer.
6. SCLK: Serial clock for SPI interface.
7. SDO_AG, SDO_M: Data output lines for SPI interfaces (accelerometer/gyroscope and magnetometer).
8. SDI: Data input line for SPI interface.
9. DEN_AG: Data enable pin for accelerometer/gyroscope.
10. INT1_AG, INT2_AG, INT_M: Interrupt pins for generating interrupts based on certain conditions.
The remaining pins are typically reserved or not connected. This sensor allows for flexible interfacing and is used in applications requiring motion sensing, orientation detection, and inertial navigation.
Manufacturer
Application
1. Consumer Electronics: Used in smartphones and tablets for screen orientation, gesture recognition, and augmented reality applications.
2. Wearable Devices: Enables motion tracking and activity monitoring in fitness bands and smartwatches.
3. Drones and Robotics: Assists in navigation, stabilization, and control systems.
4. Industrial Automation: Provides input for machine motion control and monitoring.
5. Gaming and Virtual Reality: Enhances user experiences with precise motion detection.
6. Automotive Systems: Used in driver assistance systems and vehicle dynamics monitoring.
Its compact size and low power consumption make it ideal for various applications requiring precise motion sensing.