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LTM4649EY#PBF
+BOMDC DC CONVERTER 0.6-3.3V 33W
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メーカーテキサス・インスツルメンツ
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メーカー品番 #LTM4649EY#PBF
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在庫状況5644
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | µModule® |
| Part Status | Active |
| Base Product Number | LTM4649 |
| Type | Non-Isolated PoL Module |
| Number of Outputs | 1 |
| Voltage - Input (Min) | 4.5V |
| Voltage - Input (Max) | 16V |
| Voltage - Output 1 | 0.6 ~ 3.3V |
| Current - Output (Max) | 10A |
| Applications | ITE (Commercial) |
| Features | OCP, OVP |
| Operating Temperature | -40°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package | 68-BBGA Module |
| Size / Dimension | 0.59" L x 0.35" W x 0.19" H (15.0mm x 9.0mm x 4.9mm) |
| Supplier Device Package | 68-BGA (15x9) |
| Packaging | Tray |
概要
Description
Features
- Dual synchronous buck regulator in a single µModule with PMBus/I2C control.
- Wide input voltage range (typical 4.5V–60V) with undervoltage protection.
- Two independently configurable outputs with sequencing and soft-start.
- Remote sense and accurate output regulation for load transients.
- Programmable via PMBus/SMBus (setpoints, readbacks, status/fault reporting).
- Robust protection: overcurrent/short-circuit limits, overvoltage protection, thermal shutdown.
- High efficiency and compact power density; minimal external components (feedback resistors only).
- Fault reporting and power-good signals; status indicators.
- Wide operating temperature (industrial to extended) suitable for harsh environments.
- Includes integrated inductor, drivers, and MOSFETs (no external power stages required).
Note: For exact voltage ranges, current limits, sequencing details, and pinout, please refer to the latest datasheet for the EY#PBF package variant.
Manufacturer
- What kind of company: An American multinational semiconductor company that designs and manufactures analog, mixed-signal, and DSP integrated circuits, including power-management and data-conversion products.
Application
- High‑current CPU/GPU/FPGA/ASIC core and memory rails
- Point‑of‑load regulators on servers, motherboards, and gaming PCs
- Telecom and networking equipment power rails
- Industrial and automotive electronics requiring compact, efficient power modules
- Embedded AI accelerators and other multi‑rail systems with tight form factor constraints
Note: RoHS Pb‑free packaging (PBF).