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LTM8026EY#PBF
+BOMDC DC CONVERTER 1.2-24V
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メーカーテキサス・インスツルメンツ
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メーカー品番 #LTM8026EY#PBF
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在庫状況7707
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | µModule® |
| Part Status | Active |
| Base Product Number | LTM8026 |
| Type | Non-Isolated PoL Module |
| Number of Outputs | 1 |
| Voltage - Input (Min) | 6V |
| Voltage - Input (Max) | 36V |
| Voltage - Output 1 | 1.2 ~ 24V |
| Current - Output (Max) | 5A |
| Applications | ITE (Commercial) |
| Features | OTP, OVP, SCP |
| Operating Temperature | -40°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package | 81-BBGA Module |
| Size / Dimension | 0.59" L x 0.44" W x 0.11" H (15.0mm x 11.3mm x 2.8mm) |
| Supplier Device Package | 81-BGA (15x11.25) |
| Packaging | Tray |
概要
Description
Features
- Fully integrated μModule: controller, high‑speed switches, inductor and most passives in a single compact package.
- Wide input voltage range with programmable/fixed output options.
- High efficiency via synchronous rectification; minimal external components.
- Fixed-frequency, peak‑current‑mode control with soft‑start and enable/shutdown.
- Remote sensing for accurate regulation and good load regulation.
- Robust protection: overcurrent/short-circuit protection, overtemperature/thermal shutdown, and undervoltage lockout.
- RoHS-compliant packaging (EY#PBF) with factory‑tested performance.
- Accessible design resources: evaluation board and reference designs.
Note: Exact Vin/Vout ranges and current capability depend on the specific LTM8026 variant; consult the datasheet for precise specifications.
Manufacturer
- What kind of company: A multinational American semiconductor company that designs and manufactures analog, mixed-signal, and DSP integrated circuits, including power-management ICs. ADI acquired Linear Technology in 2017 and continues the LTM µModule regulator family.
Application
- Point‑of‑load power for CPUs/GPUs, FPGAs, and ASICs in servers, workstations, telecom and data-center equipment
- Industrial control, motor drives, and robotics
- Automotive and e‑mobility electronics
- Networking/communications gear power rails
- Portable or space‑constrained instruments and lab/prototyping benches
(Uses a micromodule approach for rugged, high‑density DC‑DC conversion.)