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M2GL005-VFG256
+BOMIC FPGA 161 I/O 256FBGA
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メーカーマイクロチップ・テクノロジー
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メーカー品番 #M2GL005-VFG256
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在庫状況3632
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | IGLOO2 |
| PartStatus | Active |
| BaseProductNumber | M2GL005 |
| DigiKeyProgrammable | Not Verified |
| NumberofLogicElements/Cells | 6060 |
| TotalRAMBits | 719872 |
| NumberofI/O | 161 |
| Voltage-Supply | 1.14V ~ 2.625V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package | 256-LFBGA |
| SupplierDevicePackage | 256-FPBGA (14x14) |
| Packaging | Tray |
概要
Description
IGLOO2 FPGAs are used in applications requiring secure data processing and transmission, often in industries such as aerospace, defense, communications, and industrial automation. They offer a range of features including high-speed SerDes, integrated memory blocks, DSP capabilities, and advanced security features like hardware cryptographic accelerators and secure boot.
The device supports various I/O standards and interfaces, making it versatile for different application needs. Its flash-based architecture provides benefits like instant-on capability and resistance to radiation-induced upsets. Overall, the M2GL005-VFG256 is a robust solution for applications demanding secure, reliable, and efficient FPGA functionality.
Equivalent
1. Lattice Semiconductor: LatticeECP3 series (e.g., LFE3-17EA)
2. Xilinx: Spartan-6 series (e.g., XC6SLX9)
3. Intel (Altera): Cyclone IV series (e.g., EP4CE6)
These products offer similar functionality for applications requiring low-power, cost-effective FPGA solutions. However, specific features and performance may differ.
Features
1. Architecture: Non-volatile technology with up to 5K logic elements (LEs) for varied application needs.
2. Low Power: Optimized for low power consumption without compromising performance.
3. Security: Built-in security features including secure boot, encryption, and tamper detection.
4. Memory: Embedded RAM blocks and DSP blocks for efficient data processing and storage.
5. I/O Options: A variety of high-speed I/O options including LVDS and PCIe interfaces.
6. Temperature Range: Suitable for industrial temperature ranges.
7. Packaging: Available in a 256-ball fine-pitch ball grid array (FBGA) package.
These features make it suitable for applications like industrial automation, telecommunications, and other embedded systems that require reliable performance with enhanced security and power efficiency.
Pinout
1. Power and Ground: Dedicated pins for power supply and grounding to ensure stable operation.
2. I/O Pins: Multiple general-purpose input/output (GPIO) pins that can be configured for various interfaces.
3. Dedicated Function Pins:
- JTAG: For programming and debugging.
- Clock Management: Pins for clock input to support the internal clock networks.
- Configuration Pins: For device configuration and mode selection.
- Analog Pins: If applicable, for integrating analog functions.
These pins support a range of I/O standards and can be used for high-speed serial interfaces, memory interfaces, and other peripheral connections. The device is suitable for applications in industrial, automotive, and communications sectors, offering flexibility with its secure, low-power architecture.