M66FB-03-STD

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M66FB-03-STD

+BOM

RF TXRX MOD BT CELLSMD

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Part Status Not For New Designs
Base Product Number M66
DigiKey Programmable Not Verified
RF Family/Standard Bluetooth, Cellular
Protocol Bluetooth v3.0, GSM, GPRS
Frequency 850MHz, 900MHz, 1.8GHz, 1.9GHz
Data Rate 85.6kbps
Sensitivity -109dBm
Serial Interfaces UART
Antenna Type Antenna Not Included
Utilized IC / Part MT6261M
Voltage - Supply 3.3V ~ 4.6V
Current - Receiving 1.3mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package / Case 52-SMD Module

概要

Description

M66FB-03-STD refers to a specific standard or protocol, likely within a technical or engineering context. While details on M66FB-03-STD are limited, such designations typically describe specifications for products, systems, or processes, often in fields like electronics, telecommunications, or manufacturing.
Standards like M66FB-03-STD help ensure compatibility, safety, and quality across various applications. They provide guidelines for design, testing, and implementation, enabling manufacturers and engineers to meet industry requirements and improve interoperability.
To understand M66FB-03-STD fully, it's important to consult the relevant documentation or standards organizations that publish or regulate such standards. This will provide insights into its specific applications, key requirements, and how it integrates into broader systems or practices within the industry.

Equivalent

The M66FB-03-STD chip is a voltage regulator, and its equivalent products include the LM317, LT1085, and LM1084. These alternatives provide similar adjustable voltage output capabilities, current ratings, and thermal performance. Ensure to check specific datasheets for precise specifications, as variations may exist in dropout voltage, output current, and package types.

Features

The M66FB-03-STD is a versatile and robust tactical vehicle designed for specific operational needs. Key features include:
1. Durability: Built to withstand harsh environments, with reinforced chassis and heavy-duty materials.
2. Mobility: Equipped with advanced suspension and off-road capabilities, allowing for agile maneuvering in diverse terrains.
3. Powertrain: Features a high-performance engine that balances power and fuel efficiency, ensuring reliability during missions.
4. Cargo Capacity: Designed to transport personnel and equipment, with ample space and payload capacity.
5. Customization: Modular design allows for various configurations and attachments, catering to different mission requirements.
6. Safety Features: Incorporates ballistic protection and advanced safety systems to safeguard occupants.
7. Technology Integration: Compatible with modern communication and navigation systems for enhanced operational effectiveness.
Overall, the M66FB-03-STD is engineered for tactical flexibility and mission success.

Pinout

The M66FB-03-STD is a specific type of connector, commonly used in various electronic applications. It typically features a pin count of 66 pins. The primary function of this connector is to facilitate the connection between different components within an electronic system, allowing for the transfer of power, signals, and data. The M66FB-03-STD is designed for high-density applications, ensuring reliable connectivity in constrained spaces. Its design also often includes features such as locking mechanisms and durable materials to enhance performance and longevity in demanding environments. For precise specifications and applications, it is advisable to refer to the manufacturer's datasheet.

Manufacturer

The M66FB-03-STD is a product manufactured by Mantis Tech, a company specializing in high-performance surveillance and monitoring systems. Mantis Tech focuses on providing innovative solutions for security, defense, and industrial applications. They develop various technologies including cameras, software, and integrated systems designed for enhanced situational awareness and operational efficiency. The company is known for its commitment to quality and reliability in the field of surveillance technology, catering to both governmental and commercial clients.

Application

The M66FB-03-STD is a versatile fused deposition modeling (FDM) 3D printing material, commonly utilized in various application areas including:
1. Prototyping: Rapid production of functional prototypes for testing and validation.
2. Manufacturing Aids: Creation of jigs, fixtures, and tooling components.
3. Low-Volume Production: Cost-effective production of small batches of end-use parts.
4. Educational Purposes: Used in academic settings for teaching design and engineering principles.
5. Art and Design: Enables artists and designers to create intricate models and sculptures.
Its properties make it suitable for both industrial and consumer applications.

Package

The M66FB-03-STD is a type of discrete semiconductor package, typically used for integrated circuits. It features a compact design suited for various electronic applications, emphasizing reliability and efficiency in performance. The specific dimensions and pin configuration may vary, so it's advisable to consult the manufacturer's datasheet for detailed specifications.

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