MCIMX6X2EVN10AC

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MCIMX6X2EVN10AC

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IC MPU I.MX6SX 1GHZ 400MAPBGA

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仕様

属性
Series i.MX6SX
Part Status Active
Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores / Bus Width 2 Core, 32-Bit
Speed 227MHz, 1GHz
Co - Processors / DSP Multimedia; NEON™ MPE
RAM Controllers LPDDR2, LVDDR3, DDR3
Graphics Acceleration Yes
Display & Interface Controllers Keypad, LCD
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I / O 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature -20°C ~ 105°C (TJ)
Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type Surface Mount
Package / Case 400-LFBGA
Supplier Device Package 400-MAPBGA (17x17)
Additional Interfaces AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Base Product Number MCIMX6

概要

Description

The MCIMX6X2EVN10AC is a part of NXP's i.MX 6 series, a range of multimedia-focused microprocessors. This model integrates a Cortex-A9 CPU core with a 1 GHz clock speed, designed to deliver efficient performance for various embedded applications. It supports advanced media processing capabilities, making it suitable for applications requiring high-quality audio and video processing.
The microprocessor is engineered to offer robust connectivity options, including interfaces for HDMI, MIPI, and LVDS displays, alongside USB, Ethernet, and multiple other I/O configurations. It also supports numerous memory interfaces, facilitating versatile design possibilities for developers creating complex systems.
With its emphasis on power efficiency, the MCIMX6X2EVN10AC is ideal for industrial automation, smart devices, and automotive applications, where maintaining balance between performance and power consumption is crucial. The chip also supports various operating systems, enhancing its flexibility in deployment across different platforms and environments.
Overall, the MCIMX6X2EVN10AC is a versatile, high-performance solution geared towards enabling sophisticated user experiences in multimedia embedded systems.

Equivalent

The MCIMX6X2EVN10AC is part of NXP's i.MX 6 series, which includes similar products like the i.MX 6SoloX (e.g., MCIMX6X1xxxxx models) that offer similar ARM Cortex-A9 cores with integrated features. Depending on performance and feature requirements, equivalents could include other i.MX 6 series chips with slight variations in CPU cores, clock speed, or additional peripherals. When selecting an equivalent, consider the specific application needs, such as power consumption, peripheral availability, and processing power.

Features

The MCIMX6X2EVN10AC is a part of NXP's i.MX 6 series of applications processors. It integrates a range of features suitable for various embedded applications:
1. Core: It is powered by a single ARM Cortex-A9 core, operating at up to 1.0 GHz.
2. Graphics: Equipped with a 3D graphics processing unit (GPU) for rendering complex graphics, and a 2D graphics acceleration engine.
3. Memory Interface: Supports DDR3, DDR3L, LPDDR2, and LPDDR3 memory types.
4. Connectivity: Offers multiple connectivity options, including USB, Ethernet, UART, SPI, and I2C.
5. Security: Includes security features like secure boot, cryptographic acceleration, and tamper detection.
6. Multimedia: Capable of video playback and has integrated display and camera interfaces.
7. Power Management: Features low power consumption modes suitable for battery-powered applications.
8. Temperature Range: Designed to operate in extended temperature ranges, making it suitable for industrial applications.
Overall, the MCIMX6X2EVN10AC is designed to deliver efficient performance for multimedia and connectivity-focused embedded applications.

Pinout

The MCIMX6X2EVN10AC is part of the i.MX 6 series of applications processors by NXP Semiconductors. This particular model is a part of the i.MX 6SoloX family. The processor is designed for low-power, high-performance applications and integrates both an ARM Cortex-A9 core and a Cortex-M4 core.
The MCIMX6X2EVN10AC typically comes in a 19 x 19 mm, 0.8 mm pitch, BGA (Ball Grid Array) package with 624 balls. The pin count is thus 624.
The functions of this processor include enabling multimedia processing, graphics, and connectivity applications. It is used in various applications such as automotive infotainment systems, industrial automation, and smart devices, providing features like real-time processing, enhanced security, and support for multiple operating systems. Commonly supported interfaces include UART, I2C, SPI, USB, and Ethernet, along with a display interface and multimedia capabilities.

Manufacturer

The MCIMX6X2EVN10AC is manufactured by NXP Semiconductors. NXP is a global semiconductor company that provides a wide range of integrated solutions to various industries, including automotive, industrial, and consumer markets. The company is known for its expertise in producing embedded processors, microcontrollers, and communication interface devices, among other semiconductor technologies. NXP focuses on innovations in areas like secure connected devices, automotive electronics, and smart IoT solutions. Headquartered in Eindhoven, Netherlands, NXP operates worldwide, serving customers with advanced and reliable semiconductor solutions.

Application

The MCIMX6X2EVN10AC, part of the i.MX 6 series from NXP, is commonly used in applications requiring efficient multimedia processing and connectivity. Key application areas include:
1. Automotive Infotainment Systems: Supports rich graphics and audio for in-car entertainment.
2. Industrial Automation: Provides robust performance for control panels and HMI devices.
3. Healthcare: Powers medical imaging devices and patient monitoring systems.
4. Smart Home: Used in smart appliances and home automation hubs.
5. Retail and POS Systems: Provides the necessary processing power for kiosks and point-of-sale terminals.
Its flexibility and integration capabilities make it suitable for any application requiring a combination of multimedia performance and connectivity.

Package

The MCIMX6X2EVN10AC is typically available in a 400-pin MAPBGA (Mold Array Process Ball Grid Array) package. This packaging type is designed for efficient heat dissipation and compact integration, suitable for embedded applications in industrial and consumer electronics.

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