MP1657GTF-Z

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MP1657GTF-Z

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  • データシート MP1657GTF-Z DataSheet

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仕様

属性
Manufacturer Monolithic Power Systems
Package SOT-563-6
Voltage-Supply 4.5V~16V
Function Step-down type
SynchronousRectifier Yes
NumberofOutputs 1
Topology Step-Down
OperatingTemperature -40℃~+125℃
OutputType Adjustable
QuiescentCurrent 190uA
Switchtube(built-in/external) Built-in
OutputCurrent 2A
Frequency-Switching 800kHz

概要

Equivalent

Equivalent products to the MP1657GTF-Z (a step-down DC-DC converter by MPS) include:
- MP1658 (similar specs, higher output current)
- MP2307 (popular alternative, 3A output)
- LM2675 (TI equivalent, 1A output)
- AP3406 (Diodes Inc., 1.5A synchronous buck)
- SY8303 (Silergy, 3A synchronous buck).
Check datasheets for exact compatibility in voltage range, current, and package.

Features

The MP1657GTF-Z is a high-efficiency, synchronous step-down DC-DC converter with the following key features:
- Input Voltage Range: 4.5V to 18V
- Output Voltage Range: Adjustable (0.6V to 15V)
- Max Output Current: 3A
- High Efficiency: Up to 95% (PWM mode)
- Switching Frequency: 500kHz (fixed)
- Low Quiescent Current: 40μA (light load)
- Protections: Overcurrent (OCP), Overvoltage (OVP), Thermal Shutdown
- Package: SOT23-6 (compact footprint)
- Operation Modes: PWM for high efficiency, Auto PFM/PWM for light-load efficiency
Ideal for portable devices, networking equipment, and industrial applications.

Manufacturer

The MP1657GTF-Z is a power management IC (PMIC) manufactured by Monolithic Power Systems (MPS).
MPS is a leading semiconductor company specializing in high-performance power solutions, including DC-DC converters, PMICs, and motor drivers. Known for innovation and efficiency, MPS serves industries like computing, automotive, industrial, and consumer electronics. The company is headquartered in the U.S. (San Jose, California) and has a strong global presence.
For detailed specs, refer to MPS's official datasheets or distributor listings.

Package

The MP1657GTF-Z is a DFN-10 (Dual Flat No-Lead) package. It measures 3mm x 3mm with a 0.5mm pitch, making it compact for space-constrained applications. The DFN package offers good thermal performance and is commonly used in power management ICs.

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