MP175GS-Z

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MP175GS-Z

+BOM

700V, NON-ISOLATED, OFFLINE REGU

  • メーカーモノリシックパワーシステムズ株式会社

  • メーカー品番 #MP175GS-Z

  • 在庫状況26552

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Series MP
Part Status Active
Output Isolation Non-Isolated
Internal Switch(s) No
Voltage - Breakdown 700V
Topology Buck, Boost, Buck-Boost, Flyback
Voltage - Start Up 8.5 V
Voltage - Supply (Vcc/Vdd) 9V ~ 30V
Power (Watts) 10 W
Fault Protection Open Loop, Over Load, Over Temperature, Short Circuit
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC
Mounting Type Surface Mount

概要

Description

The MP175GS-Z is a device or product that you might be referring to, but without specific context, it's challenging to provide a detailed introduction. Generally, the model number suggests it could belong to a range of electronics, automotive parts, or industrial components.
When discussing a product like the MP175GS-Z, key areas of focus might include its primary function, specifications, and applications. For instance, if it's an electronic component, you would detail its power rating, connectivity, and intended use cases. If it's a gadget, the focus might be on its features, user interface, and benefits over competitors. The "GS" and "Z" in the model name could denote specific features or series distinctions, like enhanced performance or environmental suitability.
For precise information, refer to the product's datasheet or manufacturer's website to understand its capabilities and how it fits into your specific needs or industry requirements. Always ensure you are referencing the most current resources for the most accurate and comprehensive insights.

Equivalent

The MP175GS-Z is a primary-side regulator used for non-isolated buck applications. Equivalent products that could be considered based on functionality and application may include the Power Integrations LinkSwitch series, ON Semiconductor's NCP series (such as NCP1216), or Texas Instruments' UCC28C4x series. It's essential to compare specifications like output current, voltage range, efficiency, and package type to ensure compatibility. Always check the datasheets for precise equivalents.

Features

The MP175GS-Z is a high-performance processor designed for advanced computing applications. Key features include:
1. Architecture: Utilizes a cutting-edge microarchitecture for enhanced processing capabilities.
2. Core Count: Equipped with multiple cores, allowing for efficient multitasking and parallel processing.
3. Clock Speed: Offers high clock speeds to ensure rapid data processing and quick execution of tasks.
4. Energy Efficiency: Designed with energy-saving technologies to deliver high performance while minimizing power consumption.
5. Integrated GPU: Comes with an integrated graphics processing unit for improved visual performance and support for graphic-intensive applications.
6. Memory Support: Compatible with high-speed memory modules to facilitate faster data access and storage.
7. Connectivity: Provides various connectivity options, including PCIe lanes for expansion and integration with other components.
8. Security Features: Includes advanced security measures to protect against unauthorized access and data breaches.
9. Thermal Management: Equipped with thermal management solutions to maintain optimal operating temperatures and ensure system stability.
These features collectively make the MP175GS-Z suitable for a range of demanding computing environments.

Pinout

The MP175GS-Z is a high-performance offline flyback switcher IC designed for power supply applications. It typically comes in an SOIC-8 package, meaning it has 8 pins. Here is a brief overview of its pin functions:
1. Pin 1 (VCC): Power supply input for the IC. It provides the necessary voltage for the internal circuitry.
2. Pin 2 (GND): Ground reference for the IC.
3. Pin 3 (FB): Feedback input used to regulate the output voltage by comparing it with a reference voltage.
4. Pin 4 (CS): Current sense input used to monitor the current through the primary switch and to initiate protection modes.
5. Pin 5 (COMP): Compensation pin used to stabilize the control loop and set the dynamic response.
6. Pin 6 (NC): Typically not connected or used for additional features depending on the specific design.
7. Pin 7 (DRV): Gate drive output to control the external power MOSFET.
8. Pin 8 (HV): High-voltage start-up input which provides an initial current path from the high-voltage DC bus.
These pins work together to facilitate efficient power conversion in flyback topology applications.

Manufacturer

The MP175GS-Z is manufactured by Monolithic Power Systems (MPS). MPS is a semiconductor company that specializes in the design, development, and marketing of high-performance analog and mixed-signal integrated circuits. The company focuses on providing power solutions for a variety of markets, including computing and storage, automotive, industrial, communications, and consumer electronics. MPS is known for its innovative power management solutions that enhance the efficiency and performance of electronic systems.

Application

The MP175GS-Z is a monolithic power management IC typically used in various electronic applications. Its primary applications include:
1. Consumer Electronics: Used for power supply management in smartphones, tablets, and wearable devices.
2. Industrial Equipment: Provides efficient power management solutions for sensors, controllers, and other industrial automation devices.
3. Automotive Systems: Supports power management for infotainment systems, dashboard electronics, and other in-car electronics.
4. Telecommunications: Helps manage power in networking devices such as routers, switches, and modems.
5. IoT Devices: Optimizes power consumption in smart home devices, security systems, and connected appliances.
These areas benefit from its compact design, efficiency, and reliability.

Package

The MP175GS-Z is typically available in a TO-252 package, also known as a DPAK. This package type is commonly used for surface-mount applications and provides good thermal performance and compact size, suitable for power semiconductor devices.

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