MPC8560VT833LC

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MPC8560VT833LC

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IC MPU MPC85XX 833MHZ 783FCBGA

  • メーカーパナソニック電子部品

  • メーカー品番 #MPC8560VT833LC

  • パッケージ 784-BBGA

  • 在庫状況2911

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Package Tray,Tray
Series MPC85xx
ProductStatus Obsolete
CoreProcessor PowerPC e500
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 833MHz
Co-Processors/DSP Communications; CPM
RAMControllers DDR, SDRAM
GraphicsAcceleration No
Ethernet 10/100/1000Mbps (2)
Voltage-I/O 2.5V, 3.3V
OperatingTemperature 0°C ~ 105°C (TA)
Package/Case 783-BFBGA, FCBGA

概要

Description

The MPC8560VT833LC is a microprocessor from the PowerQUICC III family, developed by Freescale Semiconductor. It is designed for high-performance networking and communication applications. The processor is based on the PowerPC e500 core architecture and operates at a clock speed of 833 MHz. It features an integrated communications processor module (CPM) that supports various networking protocols and interfaces, making it suitable for a wide range of applications, including routers, switches, and gateways.
The MPC8560 includes a 32-bit system bus, DDR SDRAM controller, and multiple high-speed serial interfaces, such as PCI, RapidIO, and Ethernet. It also incorporates advanced power management features to optimize performance and energy efficiency. The processor supports industrial temperature ranges, ensuring reliable performance in demanding environments.
Overall, the MPC8560VT833LC offers a balanced combination of processing power, flexibility, and connectivity, making it a popular choice for developers looking to build robust and scalable networked systems.

Equivalent

The MPC8560VT833LC is a PowerQUICC III integrated communications processor from NXP (formerly Freescale). Equivalent products typically come from other manufacturers offering similar capabilities in embedded communications processing. Consider processors like ARM-based solutions with integrated Ethernet, DSPs from Texas Instruments, or other communications processors from vendors like Broadcom or Marvell. Specific model equivalents depend on the required features like processing power, interfaces, and power consumption needs. Always verify the feature set and compatibility for your application requirements.

Features

The MPC8560VT833LC is a PowerQUICC III processor from NXP (formerly Freescale Semiconductor). It is designed for high-performance networking and telecommunications applications. Key features include:
1. e500 Core: Based on the PowerPC architecture, the e500 core operates at up to 833 MHz, delivering robust processing capability.

2. Integrated Communications Processor Module (CPM): Enhances communication capabilities with support for various protocols.
3. Memory Support: It includes a 64-bit DDR SDRAM memory controller for efficient memory management.
4. Connectivity: Offers multiple high-speed interfaces, including PCI, RapidIO, and Gigabit Ethernet controllers, supporting a wide range of networking applications.
5. Security Engine: Features an integrated security engine for cryptographic processing, enhancing data security.
6. Power Management: Designed for low power consumption to support power-sensitive applications.
7. System Interfaces: Includes I2C, DUART, and SPI interfaces, providing extensive peripheral connectivity.
8. Advanced QoS: Supports advanced quality of service features, crucial for managing data traffic in network environments.
The MPC8560VT833LC is suitable for applications requiring high data throughput and robust processing, such as routers, switches, and VoIP equipment.

Pinout

The MPC8560VT833LC is a PowerQUICC III integrated communications processor developed by NXP Semiconductors (previously Freescale Semiconductor). It is based on the e500 PowerPC core. This processor typically comes in a 783-pin FC-BGA (Flip-Chip Ball Grid Array) package.
Key functions and features of the MPC8560 include:
1. Processor Core: It features an e500 PowerPC core with advanced power management and high-performance capabilities.
2. Networking and Communication: Designed for networking applications, it includes a variety of interfaces such as Gigabit Ethernet, PCI, and RapidIO.
3. Memory Support: The processor supports DDR SDRAM with a memory controller for high-speed data transfer.
4. I/O Interfaces: It provides multiple I/O interfaces, including UART, SPI, and I2C, facilitating flexible connectivity options.
5. General Purpose: Suitable for enterprise networking, telecom, and industrial applications due to its robust processing capabilities and versatile interface support.
Always refer to the specific datasheet or technical documentation for detailed specifications and pin configuration.

Manufacturer

The MPC8560VT833LC is manufactured by NXP Semiconductors. NXP is a global semiconductor company that specializes in the design and production of a broad range of semiconductor solutions. They focus on delivering secure connectivity solutions for embedded applications across various industries, including automotive, industrial, mobile, and communication infrastructure. Formed in 2006 through the spin-off of Philips' semiconductor division, NXP is headquartered in Eindhoven, Netherlands. Known for their innovations in secure identification, automotive electronics, and industrial control, NXP's technologies are integral to numerous applications that demand high security and reliable connectivity.

Application

The MPC8560VT833LC is a PowerQUICC III processor designed for embedded applications. It is well-suited for telecommunications and networking equipment, such as routers, switches, and wireless base stations, due to its high-speed processing and communication capabilities. Additionally, it is used in industrial automation, military and aerospace systems, and high-performance storage solutions. Its integrated features, including multiple interfaces and high-speed serial connectivity, make it ideal for applications requiring robust data processing and efficient power consumption.

Package

The MPC8560VT833LC is a microprocessor from the Freescale (now NXP) PowerQUICC III family. The package type for this processor is a plastic ball grid array (PBGA), which provides a compact and efficient means of housing the chip, with ball contacts on the bottom for surface mounting on printed circuit boards.

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