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MT29F2G16ABAEAWP:E
+BOMIC FLASH 2GBIT PARALLEL 48TSOP I
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メーカーマイクロンテクノロジー株式会社
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メーカー品番 #MT29F2G16ABAEAWP:E
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在庫状況3310
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 2Gbit |
| Memory Organization | 128M x 16 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP I |
| Base Product Number | MT29F2G16 |
概要
Description
It operates with a supply voltage of 2.7V to 3.6V and is optimized for low power consumption, making it suitable for mobile and embedded applications. The memory is organized in a page size of 2048 bytes and includes features like bad block management and wear leveling to enhance reliability and longevity.
The MT29F2G16ABAEAWP:E supports a range of industrial and consumer applications, including smartphones, tablets, and other portable devices, where efficient storage solutions are critical. Its compact size and robust performance make it a preferred choice for designers looking to optimize their products.
Equivalent
Features
1. Capacity: 2GB (2 Gbit) density with a 16-bit data bus.
2. Architecture: Single-level cell (SLC) technology, offering high performance and endurance.
3. Interface: ONFI (Open NAND Flash Interface) compliant, supporting fast data transfer rates.
4. Page Size: Typically 2KB or 4KB, which enhances efficiency in read and write operations.
5. Endurance: High program/erase cycle durability, making it suitable for demanding applications.
6. Power Consumption: Low power operation, ideal for mobile and embedded applications.
7. Temperature Range: Designed to operate in industrial temperature ranges, ensuring reliability in various environments.
8. Packaging: Available in a compact BGA package, facilitating space-efficient designs.
This device is suitable for use in consumer electronics, automotive applications, and industrial systems where reliable flash memory is essential.
Pinout
The key functions of the pins include:
1. Data Pins (DQ0-DQ7): For data input and output.
2. Address Pins (A0-A17): For addressing memory locations.
3. Control Pins:
- WE (Write Enable): Initiates write operations.
- RE (Read Enable): Initiates read operations.
- CE (Chip Enable): Activates the chip for read/write operations.
- ALE (Address Latch Enable): Latches the address during commands.
- CLE (Command Latch Enable): Latches the command input.
4. Ready/Busy Pin (RB): Indicates the status of the device.
5. Vcc/Vss: Power supply and ground pins.
This structure allows for data storage, retrieval, and management in various applications, including consumer electronics and embedded systems.
Manufacturer
Micron is known for its innovation in memory solutions and plays a significant role in the development of new technologies such as 3D NAND and DRAM advancements. The company serves a diverse array of markets, including consumer electronics, enterprise storage, networking, and industrial applications. Micron's focus on research and development, along with its commitment to sustainability and corporate responsibility, positions it as a key player in the global semiconductor landscape.