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MT29F32G08CBADBWPR:D

Name: MT29F32G08CBADBWPR:D
Rating: 4.8 (15 reviews)

+BOM

IC FLASH 32GBIT PAR 48TSOP I

メーカーマイクロンテクノロジー株式会社
メーカー品番 #MT29F32G08CBADBWPR:D
在庫状況3677

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性	値
Part Status	Obsolete
Base Product Number	MT29F32G08
Digi Key Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NAND
Memory Size	32Gbit
Memory Organization	4G x 8
Memory Interface	Parallel
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	0°C ~ 70°C (TA)
Mounting Type	Surface Mount
Package / Case	48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package	48-TSOP I
Packaging	Tube

概要

Description

The MT29F32G08CBADBWPR is a NAND flash memory chip produced by Micron Technology. It is designed for high-capacity storage solutions, offering 32 gigabits (4 gigabytes) of data storage. The chip utilizes a 3D NAND architecture, enhancing performance, durability, and efficiency compared to traditional 2D NAND technologies.
Key features include a high-speed interface for fast data transfer rates, low power consumption, and support for extensive data management and error correction capabilities, making it ideal for various applications, including smartphones, tablets, and other consumer electronics.
The MT29F32G08CBADBWPR is packaged in a compact form factor, facilitating easy integration into devices. Additionally, its reliability and performance make it suitable for both consumer and industrial applications, contributing to the growing demand for efficient storage solutions in an increasingly data-driven world.

Equivalent

The MT29F32G08CBADBWPR:D chip is a NAND Flash memory device. Equivalent products include:
1. Samsung K9GAG08U0M
2. Hynix H27UAG8T2BTR
3. Micron MT29F32G08CBAC
For precise compatibility, always verify specifications such as interface, voltage, density, and packaging.

Features

The MT29F32G08CBADBWPR is a NAND Flash memory chip from Micron Technology, featuring a 32GB storage capacity. It uses a 3D NAND architecture, which enhances performance and reliability. Key specifications include:
- Interface: ONFI 2.3 compliant, supporting high-speed data transfer.
- Page Size: 16KB read/write pages, improving efficiency in data handling.
- Block Size: 128KB or 256KB, allowing flexible data management.
- Endurance: Up to 3,000 program/erase cycles, suitable for diverse applications.
- Data Retention: 10 years at 25°C, ensuring data integrity over time.
- Power Consumption: Low active and standby power, ideal for portable devices.
- Form Factor: Available in a 3.3V package, compatible with various embedded systems.
This chip is commonly used in smartphones, tablets, and other consumer electronics, providing a reliable solution for high-density storage needs.

Pinout

The MT29F32G08CBADBWPR:D is a 32Gb NAND Flash memory device from Micron Technology. It features a total of 48 pins.
The primary functions of the pins include:
- Data Pins (DQ0-DQ7): Used for data input/output.
- Command/Address Pins (A0-A27): Used for command and address input.
- Chip Enable (CE#): Activates the chip.
- Write Enable (WE#): Controls write operations.
- Read Enable (RE#): Controls read operations.
- Ready/Busy (R/B#): Indicates the status of the device (ready or busy).
- Ground (GND): Common ground connection.
- Power (VCC): Supply voltage for the device.
- VCCQ: I/O power supply.
- Reset (RST#): Resets the device.
Each pin plays a crucial role in the operation of the NAND Flash memory, facilitating communication and control between the device and the host system.

Manufacturer

The manufacturer of the MT29F32G08CBADBWPR:D is Micron Technology, Inc. Micron is an American multinational corporation that specializes in the production of semiconductor devices, particularly memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, Micron is one of the largest manufacturers of DRAM (Dynamic Random-Access Memory) and NAND flash memory, which are crucial components in a wide range of electronic devices, including computers, smartphones, and other consumer electronics.
Micron operates in the semiconductor industry, focusing on innovation and technology development to meet the growing demand for memory and storage solutions driven by advancements in computing, artificial intelligence, and data analytics. The company plays a significant role in the global supply chain for memory products and is known for its commitment to quality and sustainability in manufacturing practices.

Application

The MT29F32G08CBADBWPR:D is a NAND Flash memory chip used in various applications, including mobile devices like smartphones and tablets, solid-state drives (SSDs), automotive systems, industrial equipment, and consumer electronics. It's suitable for data storage in applications requiring high density, speed, and reliability, such as firmware storage, multimedia content, and system boot operations. Its architecture supports features like error correction and wear leveling, making it ideal for high-performance and durable storage solutions.

Package

The MT29F32G08CBADBWPR:D is a NAND Flash memory chip packaged in a 48-ball FBGA (Fine Ball Grid Array) format. This packaging provides a compact footprint and is suitable for high-density applications.

Frequently Asked Questions

Q: What is the memory capacity and organization of the MT29F32G08CBADBWPR:D?
A: It is a 32Gbit (4G x 8) NAND Flash memory, offering high-density non-volatile storage for data-intensive applications.

Q: What voltage supply does this NAND Flash require?
A: It operates with a supply voltage range of 2.7V to 3.6V, making it compatible with standard 3.3V logic systems.

Q: Is this component suitable for parallel interface designs?
A: Yes, it features a Parallel memory interface (x8), enabling high-speed data transfer in traditional NAND controller designs.

Q: What is the operating temperature range?
A: It is specified for commercial operation from 0°C to 70°C (TA), suitable for typical consumer and industrial environments.

Q: What package type is used for this device?
A: It comes in a 48-TFSOP (0.724", 18.40mm Width) package, with the supplier device package being 48-TSOP I, suitable for surface mount assembly.

Q: Is the MT29F32G08CBADBWPR:D currently in production?
A: No, its Part Status is listed as Obsolete. For new designs, please consider the base product number MT29F32G08 for current alternatives.