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MT40A1G8WE-083E:B

DRAM DDR4 8G 1GX8 FBGA

メーカーミクロン
メーカー品番 #MT40A1G8WE-083E:B
データシート MT40A1G8WE-083E:B DataSheet
在庫状況12506

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性	値
Packaging	Tray
StandardPackQty	1140

概要

Description

The MT40A1G8WE-083E:B is a DRAM module manufactured by Micron Technology. It belongs to the DDR4 SDRAM family, specifically designed to provide high-speed, efficient memory solutions for computing applications. This memory module features a 1Gb density and operates at a speed of 2400 MT/s (megatransfers per second), which allows for quick data processing and smooth multitasking performance. Its small form factor and low power consumption make it suitable for a wide range of devices, including laptops, desktops, and servers. The MT40A1G8WE-083E:B is engineered to support data-intensive applications, ensuring reliability and stability in demanding environments. With a focus on performance and efficiency, it is an ideal choice for users looking to enhance their system's memory capabilities.

Equivalent

The MT40A1G8WE-083E:B is a DDR4 SDRAM chip from Micron. Equivalent products could include other DDR4 SDRAM chips with similar specifications from brands like Samsung, SK Hynix, or Kingston. For instance, Samsung's K4A8G085WB-BCRC or SK Hynix's H5AN8G8NAFR-VKC might be considered comparable, depending on specific requirements such as speed, density, and operating voltage. Always check datasheets for exact specification matches.

Features

The MT40A1G8WE-083E:B is a DRAM chip, specifically a DDR4 SDRAM, produced by Micron Technology. Here are the key features:
1. Capacity: It offers a storage capacity of 8Gb (1G x 8) per chip.
2. Speed: The chip supports a data rate of 2400 MT/s, which indicates a high-speed data transfer capability.
3. Voltage: It operates at a low voltage of 1.2V, making it power-efficient.
4. Interface: Utilizes a Double Data Rate interface, meaning data is transferred on both the rising and falling edges of the clock signal.
5. Packaging: It comes in a compact, 78-ball FBGA package, suitable for space-constrained applications.
6. Temperature Range: Designed to operate in standard temperature ranges, suitable for consumer electronics.
7. Applications: Ideal for use in computing devices, servers, and other electronics requiring reliable and fast memory solutions.
This chip is known for its reliability and efficiency, making it a popular choice in various technological applications.

Pinout

The MT40A1G8WE-083E:B is a DDR4 SDRAM chip manufactured by Micron Technology. It has a pin count of 78. This DRAM chip is designed for use in a wide range of applications, offering a combination of high performance and energy efficiency. It typically functions as a memory storage component in computing devices, providing temporary data storage to facilitate quick access and processing by the system's CPU. The DDR4 architecture allows for higher speed and bandwidth compared to previous DDR generations, making it suitable for modern computing needs. The MT40A1G8WE series is known for its low power consumption, which is beneficial for both mobile and desktop applications.

Manufacturer

The MT40A1G8WE-083E:B is manufactured by Micron Technology, Inc. Micron is a leading global company that specializes in the production of semiconductor devices, primarily focusing on memory and storage solutions. Their product portfolio includes DRAM, NAND flash memory, and other solid-state storage technologies. Micron serves a wide array of industries, including computing, consumer electronics, automotive, industrial, and mobile applications. The company is known for its innovation and contribution to advancing memory and storage technologies, which are critical components in modern computing and electronic systems.

Application

The MT40A1G8WE-083E:B is a DDR4 DRAM chip used primarily in applications that require high-speed data processing and large memory capacities. It is commonly employed in areas such as:
1. Servers and Data Centers: Enhances performance for data-intensive tasks.
2. Networking Equipment: Supports high-throughput data transfer and processing.
3. Personal Computers and Laptops: Boosts system responsiveness and multitasking abilities.
4. Embedded Systems: Used in devices requiring efficient data handling.
5. Workstations: Facilitates complex computations and simulations.
6. Consumer Electronics: Applied in high-performance gaming consoles and streaming devices.
These applications benefit from the chip's efficient power management and fast data rates.

Package

The MT40A1G8WE-083E:B is a DRAM chip with a package type known as FBGA (Fine-Pitch Ball Grid Array). This package type is designed for high-density memory applications, offering a compact form factor suitable for modern electronic devices.

Frequently Asked Questions

Q: What is the operating speed classification of the MT40A1G8WE-083E:B?
A: This Micron DRAM is rated for an 083E speed grade, implying a maximum clock frequency of approximately 1200 MHz for DDR4 2400 standard operation.

Q: Is this component suitable for high-density server memory applications?
A: Yes, with a 1Gb x8 organization and tray packaging, it is ideal for high-density memory modules in servers and cloud computing systems.

Q: What does the standard pack quantity of 1140 indicate for procurement planning?
A: The 1140 units per tray suggests bulk tray packaging. Procurement should plan order quantities in multiples of 1140 for optimal inventory management.

Q: Can this DRAM be used in embedded systems with space constraints?
A: Likely yes, as Micron typically offers this in a standard FBGA package, but verify the specific package code from the datasheet for mechanical fit.

Q: What is the typical power consumption for this memory component?
A: As a DDR4 device, it operates at 1.2V VDD, providing lower power consumption compared to DDR3, ideal for energy-efficient designs.

Q: Is this part compatible with both industrial and commercial temperature ranges?
A: The specified part number does not include a temperature suffix; please confirm the operating temperature range from the official datasheet for your application.

Q: How does the 1G x8 configuration impact system design?
A: The x8 organization (8 data pins per chip) is standard for ECC memory modules, requiring fewer chips per rank to achieve capacity.