画像は参考用です
1Gbit 1.7V~1.9V 333MHz 84-FBGA (8x12.5) Memory (ICs) RoHS
-
メーカーミクロン
-
メーカー品番 #MT47H64M16HR-3 IT:H
-
在庫状況5019
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Packaging | 84-FBGA (8x12.5) |
| Clock Frequency | 333MHz |
| Memory Size | 1Gbit |
| Operating Temperature | -40℃~+95℃ |
| Voltage - Supply | 1.7V~1.9V |
概要
Description
- MT47H64M16: Indicates the specific model, with 64M representing 64 megabits, and 16 referring to the x16 data width.
- HR-3: Suggests the speed grade and other performance characteristics. The "-3" typically denotes a specific clock speed and timing configuration.
- IT: Stands for Industrial Temperature range, meaning it is designed to operate under more extreme temperatures (-40°C to +85°C) compared to typical consumer-grade components.
- H: May refer to a specific package type or design revision.
This component is often used in environments requiring reliable performance under varied conditions, such as industrial applications, automotive, or embedded systems. It offers a balance of speed, capacity, and power efficiency, making it suitable for a wide range of applications.
Equivalent
Features
Key features include:
1. Density and Organization: 1GB density with a 64M x 16 configuration.
2. Voltage: Operates at a standard voltage of 1.8V.
3. Speed: DDR2-667, meaning it can transfer data at 667 MT/s.
4. Packaging: Available in a 60-ball FBGA (Fine-pitch Ball Grid Array) package.
5. Temperature Range: Industrial temperature range, typically -40°C to 85°C, suitable for various environments.
6. Data Integrity: Supports ECC (Error Correction Code) for improved data reliability.
This memory module is typically used in computing applications that require high performance and reliability, such as desktops, laptops, and servers.
Pinout
Pin Count: The device typically comes in a 84-ball FBGA (Fine-pitch Ball Grid Array) package, which is a common configuration for such memory chips.
Function:
- Data Storage: It stores and retrieves data for computing tasks, handling high-speed data operations in electronic devices.
- Interface: It uses a 16-bit data bus for data transfer.
- Clock Rate: The "-3" in its part number indicates a specific speed grade, with a maximum clock frequency of approximately 333 MHz (DDR2-667).
- Temperature Range: The "IT" indicates an industrial temperature range, suitable for environments from -40°C to +85°C.
- Other Features: It supports various operations like burst read/write, bank management, and power-saving modes, common in DDR2 memory modules.
This component is used in applications requiring efficient, high-speed memory solutions, such as computing devices and embedded systems.