MT6133AT

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MT6133AT

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  • メーカーMagn Tek

  • メーカー品番 #MT6133AT

  • データシート MT6133AT DataSheet

  • 在庫状況22816

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Manufacturer Magn Tek
Package SOT-23
Operating Temperature -50℃~+150℃
Voltage - Supply 1.65V~5V
Operation Points ±18Gs
Type Bipolar type
Release Points ±13Gs
Magnetic delay 5Gs

概要

Equivalent

The MT6133AT is a power management IC (PMIC) for MediaTek platforms. Equivalent alternatives include:
1. MT6328 – Another MediaTek PMIC with similar functions.
2. MT6358 – A newer PMIC for MediaTek SoCs.
3. RT5081 (Richtek) – A compatible PMIC for power regulation.
4. MAX77826 (Maxim Integrated) – A multi-function PMIC.
Check datasheets for exact compatibility.

Manufacturer

The MT6133AT is manufactured by MediaTek Inc., a Taiwanese semiconductor company specializing in wireless communications and multimedia solutions.
MediaTek is a leading global fabless semiconductor company, known for designing chips for smartphones, smart devices, and connectivity products. It competes with Qualcomm and Samsung in mobile processors and modem technologies. The MT6133AT is part of MediaTek’s RF transceiver lineup, supporting 2G/3G/4G networks.
Founded in 1997, MediaTek is headquartered in Hsinchu, Taiwan, and is a key player in affordable and mid-range mobile markets.

Application

The MT6133AT is primarily used in mobile communication devices, especially in GSM/GPRS/EDGE systems. Key application areas include:
1. Feature Phones – Basic mobile phones with 2G connectivity.
2. M2M Modules – IoT and machine-to-machine communication devices.
3. Wireless Terminals – Low-cost wireless communication devices.
4. Embedded Systems – Industrial and automotive telematics requiring 2G support.
It integrates RF transceiver functions, supporting efficient signal processing for 2G networks.

Package

The MT6133AT is a QFN (Quad Flat No-leads) package. It features a compact, surface-mount design with exposed pads for thermal and electrical performance. The package is lead-free and suitable for high-frequency applications, commonly used in RF and wireless communication modules. Exact dimensions vary, but it typically has a small footprint (e.g., 5x5mm or similar). Check the datasheet for precise specs.

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