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NT5CB256M16ER-FLI
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メーカー南アジアのテクノロジー
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メーカー品番 #NT5CB256M16ER-FLI
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データシート NT5CB256M16ER-FLI DataSheet
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在庫状況7290
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | EA |
| Automotive | Unknown |
| PPAP | Unknown |
| Mounting | Surface Mount |
| Package Height | 1(Max) |
| Package Width | 8 |
| Package Length | 13 |
| PCB changed | 96 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 96 |
概要
Description
Key features of this memory chip include a capacity of 4Gb (gigabits), with an organization of 256Mx16, meaning it has 256 million words of 16 bits each. It operates at a supply voltage of 1.5V and supports a data transfer rate of up to 1600 MT/s (megatransfers per second), which is typical for DDR3 memory, providing a balance of speed and power efficiency.
The NT5CB256M16ER-FLI is equipped with an FBGA (Fine-Pitch Ball Grid Array) package, which allows for a compact form factor suited for integration into a wide range of electronic applications. It supports various features like automatic refresh, self-refresh, and a programmable mode register, ensuring reliable performance and flexibility in different operational scenarios.
Equivalent
1. Micron MT41K256M16TW-107: A 4Gb DDR3L SDRAM chip.
2. Samsung K4B4G1646E-BYK0: A 4Gb DDR3L SDRAM option.
3. Hynix H5TQ4G63AFR-PBC: Another 4Gb DDR3L SDRAM chip.
4. Kingston D2516EC4BXGGB: A similar 4Gb DDR3L SDRAM module.
These alternatives are designed to meet similar specifications and performance standards.
Features
1. Capacity and Configuration: It is organized as 256 Meg x 16 bits, providing a total memory capacity of 4 Gb (gigabits).
2. Speed and Bandwidth: Supports data transfer rates of up to 1866 Mbps (megabits per second) per pin, offering high-speed performance suitable for a wide range of applications.
3. Voltage: Operates at a typical voltage of 1.5V for standard DDR3 applications.
4. Package: Comes in a 96-ball FBGA package, which is compact and suitable for high-density memory applications.
5. Temperature Range: Supports industrial temperature ranges, ensuring reliability in various environments.
6. ECC Support: Includes Error Correction Code (ECC) capabilities, enhancing data integrity and reliability during data transfers.
These features make the NT5CB256M16ER-FLI a versatile and robust choice for applications requiring high-speed memory performance, such as computing, networking, and consumer electronics.
Pinout
The primary functions of the pins/balls include power and ground connections, data input/output, address and control signals, clock inputs, and other necessary signals for DDR3 operation. For exact pin configuration, including the assignment and detailed functionality, it's important to refer to the official datasheet or technical documentation provided by the manufacturer. This document will provide specific information on the ball layout, function of each pin, and recommended operating conditions.
Manufacturer
Application
1. Consumer Electronics: Used in devices like smart TVs, tablets, and set-top boxes for efficient data handling.
2. Mobile Devices: Integrated in smartphones and tablets to enhance multitasking and performance.
3. Computing: Utilized in laptops and desktops to improve speed and efficiency.
4. Networking Equipment: Employed in routers and switches for fast data processing.
5. Embedded Systems: Used in automotive infotainment systems and industrial control systems for reliable data storage and retrieval.
This component is favored for its balance of speed, efficiency, and power management.
Package
Frequently Asked Questions
Q: What is the primary application for the NT5CB256M16ER-FLI?
A: It is a 4Gb DDR3 SDRAM (256Mx16) ideal for computing, networking, and embedded systems requiring high-speed data processing.
Q: Does this component support surface mount technology (SMT)?
A: Yes, it is designed for Surface Mount with a 96-pin TFBGA package, suitable for automated assembly processes.
Q: What is the operating temperature range for this memory chip?
A: Based on the "-FLI" suffix, it typically operates in an industrial temperature range (-40°C to +95°C) for reliable performance in harsh environments.
Q: Is the NT5CB256M16ER-FLI RoHS compliant?
A: Yes, it is EU RoHS Compliant, meeting environmental standards for lead-free manufacturing.
Q: What is the physical package size of this component?
A: The TFBGA package has dimensions of 13mm length, 8mm width, and 1mm max height, enabling compact PCB layouts.
Q: Can this memory be used in automotive applications?
A: No, its Automotive status is "Unknown" with no PPAP support, so it is not recommended for automotive or safety-critical systems.
Q: What does the 256Mx16 organization mean for system design?
A: It offers 256 million words with a 16-bit data bus, suitable for systems requiring a 16-bit memory interface, such as low-power processors.