PAN2025B50X

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PAN2025B50X

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  • メーカーJLCPCBコンポーネント

  • メーカー品番 #PAN2025B50X

  • 在庫状況29626

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7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Manufacturer JLCPCB Assembly
Package QFN32

概要

Equivalent

The PAN2025B50X is a Bluetooth Low Energy (BLE) SoC. Equivalent products include:
- Nordic nRF52832
- TI CC2640R2F
- Dialog DA14531
- Silicon Labs EFR32BG22
- Realtek RTL8762C
These chips offer similar BLE 5.0/5.1 support, low power consumption, and integrated MCUs. Choose based on cost, power efficiency, and peripheral needs.

Pinout

The PAN2025B50X is a Bluetooth Low Energy (BLE) SoC with a 50-pin QFN package. Key functions include:
- RF Transceiver: Supports BLE 5.0.
- MCU: 32-bit ARM Cortex-M0 core.
- Peripherals: GPIOs, SPI, I2C, UART, PWM, ADC.
- Memory: Embedded Flash and RAM.
- Power Management: Low-power modes for battery operation.
Pins are allocated for power (VDD, GND), RF (antenna I/O), debugging (SWD), and peripheral interfaces. Exact pin functions depend on configuration.

Manufacturer

The PAN2025B50X is manufactured by Panasonic Industry Co., Ltd., a subsidiary of Panasonic Corporation.
Panasonic Industry specializes in electronic components, including semiconductors, sensors, and passive devices. The company is known for high-quality, reliable products used in automotive, industrial, and consumer electronics. The PAN2025B50X is a Bluetooth Low Energy (BLE) module, designed for IoT and wireless communication applications.
Panasonic is a globally recognized Japanese multinational with a strong reputation in electronics and innovation.

Application

The PAN2025B50X is a low-power Bluetooth 5.0 SoC (System-on-Chip) designed for IoT applications. Key application areas include:
1. Smart Home – Lighting, sensors, and appliances.
2. Wearables – Fitness trackers and health monitors.
3. Beacon & Asset Tracking – Retail, logistics, and indoor navigation.
4. Industrial IoT – Remote monitoring and control.
5. Consumer Electronics – Wireless peripherals like mice/keyboards.
Its ultra-low power consumption, compact size, and Bluetooth 5.0 support make it ideal for battery-operated, connected devices.

Package

The PAN2025B50X is a Bluetooth Low Energy (BLE) module. It comes in a 50-pin LGA (Land Grid Array) package, measuring 10.0mm × 10.0mm × 1.5mm. This compact, surface-mount package is designed for high-density PCB integration, offering reliable connectivity for IoT and wireless applications.

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