RTL8761ATV-CG

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RTL8761ATV-CG

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仕様

属性
Manufacturer Realtek Semicon
Package QFN-32-EP(4x4)
Voltage - Supply 3V~3.6V
Data Rate 115.2kbps
Interface UART
Operating Temperature 0℃~+70℃
Applications Bluetooth

概要

Description

The RTL8761ATV-CG is a Bluetooth Low Energy (BLE) system-on-chip (SoC) by Realtek, designed for IoT and wireless applications. It integrates a 32-bit ARM Cortex-M0 core, BLE 5.0 support, and low-power operation for battery-powered devices. Key features include:
- Bluetooth 5.0 (2Mbps, LE Long Range, Advertising Extensions)
- Embedded Flash (512KB) and SRAM (64KB)
- Rich peripherals (GPIO, PWM, ADC, UART, SPI, I²C)
- Ultra-low power consumption (ideal for wearables and sensors)
- Compact QFN package (suitable for space-constrained designs)
Applications include smart home devices, wearables, beacons, and HID peripherals. The chip supports Realtek’s development tools and SDK for firmware customization.
For detailed specs, refer to the datasheet or Realtek’s official documentation.

Equivalent

The RTL8761ATV-CG is a Bluetooth 5.0 SoC by Realtek. Equivalent alternatives include:
- Nordic nRF52832 (Bluetooth 5.0, low power)
- TI CC2640R2F (Bluetooth 5.0, BLE-focused)
- Dialog DA14531 (Bluetooth 5.1, ultra-low power)
- Silicon Labs EFR32BG22 (Bluetooth 5.2, energy-efficient)
These chips offer similar Bluetooth/BLE functionality, though pin compatibility and features may vary. Check datasheets for exact specs.

Features

The RTL8761ATV-CG is a Bluetooth 5.0 dual-mode (BR/EDR/BLE) SoC by Realtek, designed for low-power IoT and audio applications. Key features include:
- Bluetooth 5.0 with support for BLE, BR/EDR, and enhanced data rate (2Mbps).
- ARM Cortex-M0 MCU with embedded flash memory.
- Low power consumption, optimized for battery-operated devices.
- Integrated audio codec (16-bit ADC/DAC) for voice and music applications.
- Multi-protocol support: HFP, A2DP, AVRCP, SPP, HID, and GATT profiles.
- Rich interfaces: UART, I2C, SPI, PWM, GPIO, and ADC.
- Compact package: QFN-32 (4x4mm), suitable for space-constrained designs.
- Applications: TWS earbuds, wearables, smart home devices, and wireless audio accessories.
It offers a cost-effective, low-power solution with robust Bluetooth connectivity.

Pinout

The RTL8761ATV-CG is a Bluetooth 5.0 SoC from Realtek, primarily used in wireless audio and IoT applications.
- Pin Count: 48-pin (QFN package).
- Key Functions:
- Bluetooth 5.0 (BR/EDR/LE) with low power consumption.
- ARM Cortex-M0 MCU for embedded processing.
- Audio support (I2S, PCM, SPDIF for headsets/TWS earbuds).
- GPIOs, UART, SPI, I2C for peripheral interfacing.
- Integrated PMU (power management unit).
- Supports OTA firmware updates.
Commonly used in TWS earbuds, Bluetooth speakers, and smart home devices.

Manufacturer

The RTL8761ATV-CG is manufactured by Realtek Semiconductor Corp., a Taiwanese company specializing in semiconductor design.
Realtek is a leading IC designer known for products like network controllers, audio codecs, and Bluetooth/Wi-Fi chips. The RTL8761ATV-CG is a Bluetooth system-on-chip (SoC) commonly used in wireless earbuds, headphones, and IoT devices.
Founded in 1987, Realtek is a major player in the global semiconductor industry, supplying chips for consumer electronics, networking, and multimedia applications.

Application

The RTL8761ATV-CG is a Bluetooth 5.0 dual-mode system-on-chip (SoC) by Realtek, widely used in:
1. Wireless Audio – TWS earbuds, headsets, and speakers.
2. IoT Devices – Smart home gadgets, wearables, and remote controls.
3. PC Peripherals – Wireless keyboards, mice, and dongles.
4. Health Tech – Fitness trackers and medical monitoring devices.
5. Toys & Gaming – Bluetooth-enabled toys and controllers.
Its low power consumption, compact design, and support for Bluetooth Low Energy (BLE) make it ideal for battery-operated and portable applications.

Package

The RTL8761ATV-CG is a Bluetooth 5.0 system-on-chip (SoC) from Realtek, packaged in a QFN-48 (Quad Flat No-leads, 48-pin) form factor. It integrates a low-power ARM Cortex-M0 core, RF transceiver, and peripherals for IoT and audio applications. The compact QFN package ensures efficient thermal performance and space-saving PCB design.

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