画像は参考用です
RTL8852BS-CG
+BOM-
メーカーJLCPCBコンポーネント
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メーカー品番 #RTL8852BS-CG
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在庫状況22651
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Manufacturer | JLCPCB Assembly |
| Package | QFN-76_9x9mm |
概要
Description
### Key Features:
- Dual-band Wi-Fi 6 (2.4GHz & 5GHz) with OFDMA, MU-MIMO, and 1024-QAM for faster speeds.
- Bluetooth 5.2 with LE Audio support.
- Low power consumption, ideal for battery-powered devices.
- PCIe & USB interfaces for flexible integration.
- Compact form factor (QFN package).
### Applications:
- Laptops, tablets, and smart devices.
- IoT gateways and industrial systems.
- Consumer electronics requiring Wi-Fi 6 efficiency.
The chip offers improved throughput, reduced latency, and better coexistence with other wireless devices, making it a cost-effective solution for modern connectivity needs.
Equivalent
- Realtek RTL8852BE (similar specs, different package)
- Intel AX201/AX200 (Wi-Fi 6/BT, requires Intel host)
- MediaTek MT7921 (Wi-Fi 6/BT combo)
- Qualcomm QCA6391 (Wi-Fi 6/BT 5.1)
These chips offer comparable Wi-Fi 6 and Bluetooth 5.x functionality but may vary in host interface (PCIe/USB) or platform compatibility.
Features
- Wi-Fi 6 (802.11ax) support for 2.4GHz & 5GHz bands.
- Bluetooth 5.2 with LE/BR/EDR support.
- 1T1R (1x1) antenna configuration, up to 574Mbps (5GHz) & 287Mbps (2.4GHz).
- OFDMA & MU-MIMO for improved multi-device efficiency.
- Low-power design for IoT/portable devices.
- PCIe & USB 2.0/3.0 interfaces.
- Target applications: Laptops, tablets, smart TVs, and embedded systems.
Compact and cost-effective, it balances performance and power efficiency for mainstream Wi-Fi 6 devices.
Pinout
- Pin Count: ~48 pins (exact count may vary by package variant).
- Functions:
- Dual-band Wi-Fi 6 (2.4GHz & 5GHz) with MU-MIMO and OFDMA support.
- Bluetooth 5.2 (LE/EDR).
- Interfaces: SDIO (for Wi-Fi), UART/PCM (for Bluetooth), and GPIOs for control.
- Supports PCIe or USB (depends on configuration).
- Low-power modes for IoT/portable devices.
Designed for space-constrained applications like laptops, dongles, and embedded systems.