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SI3127DV-T1-GE3
+BOMMOSFET P-CH 60V 3.5A/13A 6TSOP
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メーカービシェイ・シリコニクス
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メーカー品番 #SI3127DV-T1-GE3
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データシート SI3127DV-T1-GE3 DataSheet
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在庫状況26690
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | TrenchFET® |
| Part Status | Active |
| Base Product Number | SI3127 |
| FET Type | P-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 60 V |
| Current - Continuous Drain (Id) @ 25°C | 3.5A (Ta), 13A (Tc) |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
| Rds On (Max) @ Id, Vgs | 89mOhm @ 1.5A, 4.5V |
| Vgs(th) (Max) @ Id | 3V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 30 nC @ 10 V |
| Vgs (Max) | ±20V |
| Input Capacitance (Ciss) (Max) @ Vds | 833 pF @ 20 V |
| Power Dissipation (Max) | 2W (Ta), 4.2W (Tc) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | 6-TSOP |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
概要
Description
Key features of such ICs often include low power consumption, high efficiency, and robust thermal performance. The "GE3" suffix often indicates specific package type or environmental compliance, such as RoHS, which ensures the device is free from certain hazardous substances.
When integrating the SI3127DV-T1-GE3 into a design, engineers consider factors like input and output voltage range, current rating, and thermal management to ensure optimal performance and reliability. Always refer to the manufacturer's datasheet for detailed specifications and application guidelines.
Equivalent
1. AO3407A by Alpha & Omega Semiconductor
2. FDN5618P by ON Semiconductor
3. PMV65XP by Nexperia
4. IRLML6401 by Infineon Technologies
These equivalents are selected based on similar electrical characteristics and package type, but always verify specifications to ensure compatibility with your application.
Features
1. Dual N-Channel Configuration: It offers two N-channel MOSFETs in a single package, optimizing space and simplifying circuit design.
2. Low On-Resistance: It features a low on-resistance, which minimizes power loss and enhances efficiency in switching applications.
3. High-Speed Switching: The device supports fast switching speeds, making it ideal for high-frequency applications.
4. Compact Package: Typically housed in a small, space-saving package like the PowerPAK® SO-8, it is suitable for compact electronic designs.
5. Thermal Performance: It is designed to handle significant power loads while maintaining effective thermal performance.
6. Rugged Design: The MOSFET is built to withstand voltage and current stresses, enhancing its reliability in various applications.
These features make the SI3127DV-T1-GE3 suitable for applications in power management, DC-DC converters, and other electronic circuits requiring efficient switching performance.
Pinout
Here is a brief description of its pin functions:
1. Source (S1): The source terminal for the first MOSFET.
2. Gate (G1): The gate terminal for the first MOSFET, which controls the on/off state.
3. Drain (D1): The drain terminal for the first MOSFET, connected to the load.
4. Source (S2): The source terminal for the second MOSFET.
5. Gate (G2): The gate terminal for the second MOSFET.
6. Drain (D2): The drain terminal for the second MOSFET.
The SI3127DV-T1-GE3 is used primarily in applications requiring efficient power management and switching, such as DC-DC converters and load switches.