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SXBP-1430+
+BOMRF FILTER BAND PASS 1.43GHZ 8SMD
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メーカーミニサーキット
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メーカー品番 #SXBP-1430+
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在庫状況7246
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | SXBP |
| PartStatus | Active |
| Frequency | 1.43GHz Center |
| Bandwidth | 1.2GHz |
| FilterType | Band Pass |
| InsertionLoss | 1.5dB |
| MountingType | Surface Mount |
| Package/Case | 8-SMD, No Lead |
| Size/Dimension | 0.740" L x 0.440" W (18.80mm x 11.18mm) |
| Height(Max) | 0.190" (4.83mm) |
概要
Description
Researchers are particularly interested in SXBP-1430+ due to its potential to improve the efficiency of solar cells and batteries, leading to more sustainable energy solutions. Additionally, its biocompatibility opens new avenues for drug delivery systems and therapeutic agents. Ongoing studies are focused on optimizing its synthesis and exploring its interactions at the molecular level to fully harness its capabilities.
Overall, SXBP-1430+ represents a significant advancement in material science, with promising implications for future technologies and applications.
Equivalent
Features
1. Connectivity: Supports multiple wireless standards, including Wi-Fi, Bluetooth, and LPWAN technologies for versatile connectivity options.
2. High Integration: Combines microcontroller, RF components, and memory in a compact form factor, reducing the need for additional external components.
3. Low Power Consumption: Optimized for energy efficiency, making it suitable for battery-operated devices.
4. Flexible Interface: Offers various interfaces such as SPI, I2C, UART, and GPIOs for easy integration with sensors and peripherals.
5. Robust Security: Incorporates security features like encryption and secure boot to protect data transmission and device integrity.
6. Development Support: Compatible with various development environments and SDKs, facilitating rapid prototyping and development.
Overall, the SXBP-1430+ is ideal for developers looking to implement reliable, connected solutions in the growing landscape of smart devices.
Pinout
The functions of the pins are as follows:
1. RF In - Input for the RF signal.
2. GND - Ground connection.
3. VDD - Power supply voltage input.
4. RF Out - Output for the amplified RF signal.
5. Bypass - Bypass capacitor connection for power supply stability.
6. Gain Adjust - Pin for adjusting the gain.
7. VSENSE - Voltage sensing for monitoring power supply levels.
8. Thermal Pad - For heat dissipation.
9. NC - No connection (reserved).
10. Shutdown - Pin to enable/disable the amplifier.
This configuration allows for efficient amplification and control in RF applications.