TC58NVG3S0FTA00

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TC58NVG3S0FTA00

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IC FLASH 8GBIT PARALLEL 48TSOP I

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Supplier Kioxia America, Inc.
Package / Case Tray
Part Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 8Gb (1G x 8)
Memory Interface Parallel
Write Cycle Time - Word Page 25ns
Access Time 25 ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount

概要

Description

TC58NVG3S0FTA00 is a 3D NAND flash memory device from Toshiba (now Kioxia). It is a high-density non-volatile storage die used in solid-state drives, embedded storage, and other flash-based devices. The die uses stacked 3D NAND cells and provides a standard NAND interface for a controller to perform page reads/writes and block erases. It supports typical flash-management features (ECC and wear-leveling managed by the host/controller). Exact specifications (capacity, speed, endurance, package) depend on the specific revision; consult the official datasheet for precise numbers. In short: a modern 3D NAND storage die designed for SSDs and related storage applications.

Equivalent

TC58NVG3S0FTA00 is a Toshiba (now Kioxia) 3D NAND flash device. There is no public one-for-one cross reference. Closest equivalents are other vendors’ 3D NAND parts with the same capacity and interface. To cross-reference, compare capacity, page/block size, die count, NAND type (3D/BSI), voltage, package and temperature grade, then use distributor cross-reference tools or contact the supplier for an official cross.

Features

Here are the typical features of the TC58NVG3S0FTA00 (Toshiba/Kioxia) 3D NAND flash device:
- 3D NAND TLC flash memory
- High-density storage in a single die
- Multi-plane/interleaved architecture for higher throughput
- ONFI-compatible NAND interface
- On-die ECC and firmware for wear leveling, bad-block management, and garbage collection
- Data integrity features: error detection/correction and read-disturb mitigation
- Power-fail protection and robust data-retention
- Low-power operation with suitable temperature range (industrial variants available)
- Designed for embedded/consumer/high-endurance applications
Note: For exact capacity, page/block sizes, interface version, and operating conditions, please refer to the official datasheet.

Pinout

- Pin count: 48 pins (48‑pin package)
- Function: NAND flash memory (3D TLC) device for non‑volatile data storage in electronics.

Manufacturer

- Manufacturer: Kioxia Corporation (formerly Toshiba Memory; spun off from Toshiba).
- What kind of company: A Japanese multinational semiconductor company that designs and manufactures flash memory and storage solutions (NAND flash, SSDs, etc.).

Application

TC58NVG3S0FTA00 is a 3D TLC NAND flash memory. It enables high-density non-volatile storage across devices. Typical applications:
- Solid-state drives (SSDs) for PCs and data centers
- Embedded/storage in mobile devices, tablets, and ultrabooks
- Consumer electronics (cameras, camcorders, set-top boxes)
- Automotive (infotainment, telematics, data logging)
- Industrial/IoT edge devices requiring rugged storage
- Networking/storage appliances needing large, cost-effective flash memory

Package

FBGA (Fine-Pitch Ball Grid Array) package.

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