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TDA21475
+BOMInfineon IFX POWERSTAGE/DRIVER
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メーカーインフィニオンテクノロジーズ
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メーカー品番 #TDA21475
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在庫状況15930
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Packaging | Reel |
概要
Description
Key features of the TDA21475 include low switching and conduction losses, which contribute to its high efficiency. It also offers fast switching speeds and supports high-frequency operation, which allows for smaller and more cost-effective designs. Integrated protection features such as over-temperature and over-current protection enhance system reliability and robustness. The package is optimized for improved thermal performance, ensuring efficient heat dissipation. Overall, the TDA21475 is valued for its compact design, efficiency, and reliability, making it a popular choice for engineers looking to optimize power delivery in high-performance systems.
Equivalent
Features
1. Integration: Combines a driver and two MOSFETs for efficient power conversion.
2. Output Current: Supports up to 70A continuous current.
3. Efficiency: Optimized for high efficiency with low power losses, suitable for VR (Voltage Regulator) solutions.
4. Switching Frequency: Capable of operating at high frequencies for minimized output ripple and better transient response.
5. Thermal Management: Features enhanced thermal performance with effective heat dissipation.
6. Protection: Includes over-current, under-voltage, and over-temperature protection to ensure reliability.
7. Package: Comes in a compact package allowing space-saving designs on PCBs.
These features make the TDA21475 suitable for high-performance computing, data centers, and other applications requiring efficient power management and delivery.
Pinout
The TDA21475 typically features a 5x6 mm^2 package with a BGA (Ball Grid Array) configuration, which includes around 31 solder balls for connectivity. Key functions of the TDA21475 include:
1. Driver and MOSFET Integration: Streamlines design by combining high-side and low-side MOSFETs with a driver.
2. High Efficiency: Optimized for minimal power loss in high-frequency operations.
3. Temperature and Current Sensing: Provides built-in functions for real-time monitoring and protection.
4. Fast Switching: Supports high-frequency operation for improved transient response.
This module is often used in applications requiring efficient power management, such as VR12.5 and IMVP8 compatible CPU power supplies. For precise details on pin count and layout, consult the specific datasheet or manufacturer's documentation.
Manufacturer
Application
1. Data Centers: Used in server power supplies to enhance energy efficiency and thermal performance.
2. Telecommunications: Supports high-performance networking equipment with reliable power management.
3. Industrial Automation: Powers industrial control systems requiring stable and efficient power delivery.
4. Consumer Electronics: Utilized in gaming consoles and high-performance computing devices for improved power management.
5. Renewable Energy Systems: Employed in solar inverters and energy storage systems, aiding in efficient power conversion and management.
Its compact design and high efficiency make it suitable for demanding electronic applications.