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TS-1088-AR02016
+BOM-
メーカー玄浦
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メーカー品番 #TS-1088-AR02016
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データシート TS-1088-AR02016 DataSheet
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在庫状況16686
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Manufacturer | XUNPU |
| Package / Case | SMD |
| Operating Temperature | -30℃~+80℃ |
| Circuit | SPST |
| Actuator Style | Round Button |
| Switch Height | 2mm |
| Contact Current | 50mA |
| Voltage Rating | 12V |
| Length | 4mm |
| Width | 3mm |
| Termination Style | SMDSplicing |
| Mounting Type | Standing paste |
| Operating Force | 160gf |
| Life | 100000 Times |
| Actuator / Cap Color | Black |
| Strike Gundam | Without bracket |
概要
Equivalent
- ON Semiconductor AR02016 (same part, different branding)
- OmniVision OV2081 (similar specs)
- Sony IMX290 (comparable performance)
- ON Semiconductor AR0234 (higher resolution alternative)
Check datasheets for exact compatibility.
Features
- Resolution: 160×120 (19,200 pixels)
- Thermal Sensitivity: ≤50mK
- Frame Rate: 25Hz
- Spectral Range: 8–14µm (LWIR)
- Interface: UART/I²C for control, digital video output
- Power Consumption: ~1.5W
- Operating Temperature: -20°C to +60°C
- Compact Size: Lightweight and small form factor
- Applications: Security, industrial inspection, firefighting, and IoT devices.
It offers real-time thermal imaging with good sensitivity for low-contrast detection.
Pinout
- Image processing: Supports up to 1080p resolution with advanced ISP features like noise reduction, auto-exposure, and auto-white balance.
- Sensor interface: Directly interfaces with AR02016 sensors for raw image data capture.
- High-speed I/O: Includes MIPI CSI-2 for video output and other control interfaces (I2C, SPI).
- Power management: Optimized for low-power operation in embedded vision applications.
Used in automotive, surveillance, and industrial imaging systems.
Manufacturer
Teledyne Semiconductor focuses on precision analog and power management products, emphasizing ruggedness and performance in extreme environments. The TS-1088-AR02016 is likely part of their legacy or specialized product line.
For exact specifications, consult Teledyne’s official documentation or contact their support.
Application
1. Electronics – Bonding components in smartphones, tablets, and displays.
2. Automotive – Securing interior trims, panels, and insulation materials.
3. Construction – Fixing lightweight materials like insulation films and panels.
4. Packaging – Reinforcing seals and closures in durable packaging.
5. Medical Devices – Attaching sensors or lightweight components securely.
Its high adhesion, durability, and resistance to temperature and moisture make it versatile for industrial and consumer applications.