W94AD6KBHX5I

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W94AD6KBHX5I

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ISO9001 Quality Control ISO45001 ISO14001 100% Genuine

IC DRAM 1GBIT 60-VFBGA

  • メーカーウィンボンド・エレクトロニクス

  • メーカー品番 #W94AD6KBHX5I

  • データシート W94AD6KBHX5I DataSheet

  • 在庫状況7040

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Part Status Active
Base Product Number W94AD6
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR
Memory Size 1Gbit
Memory Organization 64M x 16
Clock Frequency 200 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TC)
Mounting Type Surface Mount
Package / Case 60-TFBGA
Supplier Device Package 60-VFBGA (8x9)
Packaging Tray
Access Time 5 ns

概要

Description

"W94AD6KBHX5I" appears to be a unique alphanumeric code or identifier, but without specific context or additional information, it's challenging to provide a precise introduction or explanation. Such codes are often used in various fields like technology, product identification, software keys, or data tracking. For instance, in technology, it could represent a product key for software activation, a unique identifier for a database entry, or a part of a URL in web applications. In business, it might be used for inventory management, where each item is assigned a unique code for tracking purposes. If you have more details about where or how this code is being used, I could offer a more targeted explanation. Understanding its purpose and context is essential for a complete introduction.

Equivalent

The W94AD6KBHX5I chip is a DRAM product from Winbond. Equivalent products typically include DRAM chips with similar specifications from other manufacturers. Look for DDR4 DRAM chips with similar capacity, speed, and voltage ratings from manufacturers like Samsung, Micron, or SK Hynix. Specific equivalents will depend on the required specifications such as memory size, speed, and temperature grade. Always cross-reference datasheets to ensure compatibility with your application.

Pinout

The W94AD6KBHX5I is a DRAM chip produced by Winbond. It is a type of LPDDR4X memory, typically used in applications requiring high-speed data processing and low power consumption, such as mobile devices and embedded systems. The chip is available in a 200-ball Fine Ball Grid Array (FBGA) package.
The package has several key functions and connections, including power supply pins, data I/O pins, address pins, control signal pins, and other necessary pins for communication and operation. The exact pin assignments and functions such as VDD, VSS, data lines (DQ), clock signals (CK, CK#), command (CS#), and address lines (A0-A15) are crucial for integration into devices.
For detailed pin configuration and functionality, it's essential to refer to the specific datasheet provided by the manufacturer, as it contains precise technical details required for implementation and design considerations.

Frequently Asked Questions


Q: What memory type does the W94AD6KBHX5I use, and what is its capacity?
A: It is a volatile SDRAM with LPDDR technology, offering a 1Gbit memory size organized as 64M x 16.


Q: What is the maximum clock frequency and access time of this component?
A: It operates at a 200 MHz clock frequency with an access time of 5 ns, supporting high-speed data transfer.


Q: What is the supply voltage range for the W94AD6KBHX5I?
A: The voltage supply range is 1.7V to 1.95V, typical for mobile LPDDR applications.


Q: Is this component suitable for industrial temperature environments?
A: Yes, its operating temperature range is -40°C to 85°C (TC), making it ideal for harsh industrial conditions.


Q: What is the write cycle time for word and page operations?
A: The write cycle time for word and page operations is 15 ns, ensuring reliable programming performance.


Q: What package does the W94AD6KBHX5I come in, and is it surface mount?
A: It is housed in a 60-TFBGA package with surface mount (SMT) support, supplier device package is 60-VFBGA (8x9).


Q: What is the recommended packaging for procurement?
A: The component is supplied in Tray packaging, suitable for batch handling and assembly processes.


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