X322524MOB4SI

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X322524MOB4SI

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  • メーカーYXC水晶発振器

  • メーカー品番 #X322524MOB4SI

  • データシート X322524MOB4SI DataSheet

  • 在庫状況8709

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Manufacturer YXC Crystal Oscillators
Package SMD3225-4P
OperatingTemperature -40℃~+85℃
Frequency 24MHz
FrequencyStability ±20ppm
NormaltemperatureFrequencyTolerance ±10ppm
LoadCapacitance 12pF
Type Surface Mount Crystal

概要

Equivalent

The X322524MOB4SI is a real-time clock (RTC) chip. Equivalent or similar products include:
- DS3231 (Maxim Integrated) – High-precision RTC with temperature compensation.
- PCF8563 (NXP) – Low-power I²C RTC.
- MCP7940N (Microchip) – Battery-backed I²C RTC with SRAM.
- RX-8025T (Epson) – Low-power RTC with I²C interface.
These alternatives offer comparable features like timekeeping, alarms, and I²C/SPI interfaces. Verify pin compatibility and specs for your application.

Pinout

The X322524MOB4SI is a 32.768 kHz MEMS oscillator from SiTime.
- Pin Count: 4 pins (typically in a 2.0 x 1.6 mm package).
- Functions:
- Pin 1 (VDD): Power supply (1.8V–3.3V).
- Pin 2 (GND): Ground.
- Pin 3 (OUT): Clock output (LVCMOS).
- Pin 4 (OE/NC): Output enable (optional) or no connect.
It provides high stability, low jitter, and is used in wearables, IoT, and embedded systems.

Package

The package type for X322524MOB4SI is typically BGA (Ball Grid Array). This surface-mount package is commonly used for integrated circuits, offering high pin density and reliable electrical connections. BGA packages are ideal for compact, high-performance applications like mobile devices. For exact specifications, refer to the manufacturer's datasheet.

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