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XC2S200-5FG456I
+BOMIC FPGA 284 I/O 456FBGA
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メーカーAMD
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メーカー品番 #XC2S200-5FG456I
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在庫状況3356
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | Spartan®-II |
| Part Status | Obsolete |
| Base Product Number | XC2S200 |
| Digi Key Programmable | Not Verified |
| Number of LA Bs / CL Bs | 1176 |
| Number of Logic Elements / Cells | 5292 |
| Total RAM Bits | 57344 |
| Number of I/O | 284 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
| Packaging | Tray |
| Number of Gates | 200000 |
概要
Description
Key features of the XC2S200-5FG456I include:
1. Capacity: It contains approximately 200,000 system gates, providing ample logic resources for complex designs.
2. Package and Speed: The part number indicates that it comes in a Fine-Pitch Ball Grid Array (FG456) package. The "-5" denotes the speed grade, with lower numbers indicating faster performance.
3. Temperature Range: The "I" in the part number indicates that it is rated for industrial temperature ranges, typically -40°C to +100°C, ensuring reliability in harsh environments.
4. I/O and Performance: It supports numerous I/O standards, enabling versatile interfacing with various components, and offers efficient performance for processing and data management tasks.
This FPGA is ideal for applications requiring flexibility, reliability, and moderate complexity.
Equivalent
Features
1. Logic Gates: Approximately 200,000 system gates.
2. Configurable Logic Blocks (CLBs): Includes 1,728 CLBs, arranged in a matrix, offering flexible implementation of combinational and sequential logic.
3. I/O Pins: Equipped with 284 user I/O pins, facilitating diverse interfacing possibilities.
4. Embedded Memory: Features 14,336 bits of distributed RAM for efficient data storage and retrieval.
5. Performance: Operates with a speed grade of -5, ensuring robust performance for demanding applications.
6. Temperature Range: Industrial grade, operating within -40°C to +100°C.
7. Package: Comes in a 456-pin Fine-Pitch Ball Grid Array (FG456) package, optimizing space and layout flexibility.
8. Power Management: Supports programmable power management for efficient energy use.
9. Design Tools: Compatible with Xilinx development tools for easy design and integration.
These features make the XC2S200-5FG456I suitable for a wide range of applications requiring reliable FPGA solutions.
Pinout
Key functions of the XC2S200-5FG456I include:
1. Logic Cells: It features 200,000 system gates and approximately 5,292 logic cells, offering ample resources for implementing complex digital circuits.
2. I/O Pins: The device provides a wide range of configurable I/O pins, suitable for interfacing with various external components and systems.
3. Embedded Memory: It includes Block RAMs that can be used for data storage and buffering tasks, enhancing the device's versatility.
4. Clock Management: Built-in DLLs (Delay-Locked Loops) provide clock management capabilities for synchronizing signals across the FPGA.
5. Configurable Interconnect: The programmable interconnect architecture allows for flexible routing of signals within the FPGA.
These features make the XC2S200-5FG456I suitable for applications requiring moderate complexity with cost-effective solutions.
Manufacturer
The company is known for its innovation in adaptive and intelligent computing, enabling designers to create highly flexible and efficient hardware systems. Xilinx's FPGAs allow customers to configure the chip to perform specific logic functions, making them highly versatile and suitable for custom and complex digital circuits. In 2020, Xilinx was acquired by AMD, a multinational semiconductor company known for its CPUs and GPUs, further expanding its presence and capabilities in the semiconductor industry.