仕様
| 属性 | 値 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Virtex®-II |
| Part Status | Obsolete |
| Number of LABs/CLBs | 3584 |
| Total RAM Bits | 1769472 |
| Number of I/O | 484 |
| Number of Gates | 3000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概要
Description
XC2V3000-5FG676I is a Xilinx Virtex-2 FPGA (model XC2V3000). It targets mid-density designs and comes in a FG676 (676-pin) BGA package, with speed grade -5 (moderate-speed). The device provides roughly a few thousand configurable logic cells, along with block RAM, DSP resources, and multiple PLLs for clock management, plus I/O across several banks. It is configured with a bitstream using the Xilinx ISE (Foundation/WebPACK) toolchain and can be programmed via JTAG or configuration memory. Typical applications include DSP, communications, embedded co-processing, and hardware prototyping. Note that this is an older Virtex-2 part, so verify current availability and toolchain support if starting a new project.
Features
XC2V3000-5FG676I is a Virtex‑2 FPGA in a 676‑ball FG676 package (industrial temperature, speed grade -5). Key features:
- ~3,000 logic cells with LUT-based fabric
- Industrial temperature range (-40 to 85 °C)
- On‑chip block RAM plus distributed RAM
- Dedicated DSP/multipliers for high‑speed math
- Clocking: multiple clock management tiles/PLLs with several clock outputs
- Rich I/O: many banks, 3.3V‑tolerant LVTTL/LVCMOS I/O, supports differential signaling (e.g., LVDS)
- Fast carry chains for arithmetic and data path efficiency
- JTAG and standard configuration options (Slave/Master Serial, etc.) and boot from external memory
- Flexible routing and global clock distribution for complex designs
- Supported by Xilinx ISE design tools and compatible flows
Note: exact counts (block RAM, I/O, DSP slice numbers) vary by device family and packaging; refer to the official datasheet for precise specifications.
- ~3,000 logic cells with LUT-based fabric
- Industrial temperature range (-40 to 85 °C)
- On‑chip block RAM plus distributed RAM
- Dedicated DSP/multipliers for high‑speed math
- Clocking: multiple clock management tiles/PLLs with several clock outputs
- Rich I/O: many banks, 3.3V‑tolerant LVTTL/LVCMOS I/O, supports differential signaling (e.g., LVDS)
- Fast carry chains for arithmetic and data path efficiency
- JTAG and standard configuration options (Slave/Master Serial, etc.) and boot from external memory
- Flexible routing and global clock distribution for complex designs
- Supported by Xilinx ISE design tools and compatible flows
Note: exact counts (block RAM, I/O, DSP slice numbers) vary by device family and packaging; refer to the official datasheet for precise specifications.
Pinout
- Pin count: 676 pins (FG676 package; FG676I indicates industrial temperature range)
- Function: Xilinx Virtex-2 FPGA (XC2V3000) device, a programmable logic fabric with ~3k logic cells, I/O banks, block RAM, and DSP slices.
- Function: Xilinx Virtex-2 FPGA (XC2V3000) device, a programmable logic fabric with ~3k logic cells, I/O banks, block RAM, and DSP slices.
Manufacturer
Manufacturer: Xilinx, Inc.
What kind of company: An American semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related IP/tools). Since 2020, Xilinx operates as a subsidiary of AMD.
What kind of company: An American semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related IP/tools). Since 2020, Xilinx operates as a subsidiary of AMD.
Application
Typical application areas for XC2V3000-5FG676I (Virtex-2 FPGA):
- Digital signal processing and communications (baseband, codecs, DSP accelerators)
- Video, image, and graphics processing pipelines
- Embedded systems and hardware accelerators for processors
- Data acquisition, measurement, and real-time control
- Aerospace/defense radar, sonar, and EW signal processing
- Automotive and industrial automation (sensor fusion, motor control)
- Prototyping and research hardware platforms
These cover mid-range, high-performance logic, flexible I/O, and multiple interfaces suitable for custom hardware acceleration.
- Digital signal processing and communications (baseband, codecs, DSP accelerators)
- Video, image, and graphics processing pipelines
- Embedded systems and hardware accelerators for processors
- Data acquisition, measurement, and real-time control
- Aerospace/defense radar, sonar, and EW signal processing
- Automotive and industrial automation (sensor fusion, motor control)
- Prototyping and research hardware platforms
These cover mid-range, high-performance logic, flexible I/O, and multiple interfaces suitable for custom hardware acceleration.
Package
The XC2V3000-5FG676I uses the FG676 package: a 676-ball Fine-pitch Ball Grid Array (FBGA) package, Industrial temperature range.
