仕様
| 属性 | 値 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 3328 |
| Number of Logic Elements/Cells | 29952 |
| Total RAM Bits | 589824 |
| Number of I/O | 487 |
| Number of Gates | 1500000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概要
Description
XC3S1500-4FG676C is a Xilinx Spartan-3S FPGA device. It sits in the Spartan-3S family and provides roughly 1,500 logic cells built from LUT-based logic, plus flip-flops, with distributed RAM and block RAM and multiple I/O banks. The FG676 package is a 676-ball BGA, offering high I/O density in a compact form. The -4 speed grade indicates its clock-speed option for this device family (actual performance depends on routing and usage). It’s aimed at cost-conscious, moderate-density designs and is suitable for glue logic, simple state machines, small DSP-like tasks, and peripheral interfacing. It includes clock management resources (PLL) and the usual Spartan-3S timing/routing features. Development uses Xilinx ISE Design Suite (legacy toolchain). While reliable for its era and low-cost, it lacks the higher density, speed, and newer features of Spartan-6/7-series devices and is generally considered obsolete for new designs.
Features
Key features of XC3S1500-4FG676C (Spartan-3 FPGA):
- Capacity: ~1,500 CLBs (configurable logic blocks)
- Speed grade: -4
- Package: FG676C, 676-pin fine-pitch BGA
- I/O: multiple I/O banks with 3.3V I/O (and options for 2.5V/1.8V in certain banks)
- DSP: built-in 18×18 multipliers (DSP slices) for MAC operations
- RAM: embedded block RAM plus distributed RAM
- Clocking: supports high-speed operation (Fmax in practice depends on design and tooling)
- Configuration: supports standard Xilinx configuration options (JTAG for programming/debug, various config interfaces)
- Architecture: LUT-based logic with flexible routing resources suitable for generic digital, DSP, and embedded applications
Note: exact I/O count and block RAM can vary by speed grade and package; consult the Xilinx datasheet for precise specifications.
- Capacity: ~1,500 CLBs (configurable logic blocks)
- Speed grade: -4
- Package: FG676C, 676-pin fine-pitch BGA
- I/O: multiple I/O banks with 3.3V I/O (and options for 2.5V/1.8V in certain banks)
- DSP: built-in 18×18 multipliers (DSP slices) for MAC operations
- RAM: embedded block RAM plus distributed RAM
- Clocking: supports high-speed operation (Fmax in practice depends on design and tooling)
- Configuration: supports standard Xilinx configuration options (JTAG for programming/debug, various config interfaces)
- Architecture: LUT-based logic with flexible routing resources suitable for generic digital, DSP, and embedded applications
Note: exact I/O count and block RAM can vary by speed grade and package; consult the Xilinx datasheet for precise specifications.
Pinout
- Pin count: 676 pins (FG676 FineLine BGA package)
- Function: Xilinx Spartan-3 FPGA device (XC3S1500) with about 1,500 logic cells, used as programmable digital logic fabric (speed grade -4).
- Function: Xilinx Spartan-3 FPGA device (XC3S1500) with about 1,500 logic cells, used as programmable digital logic fabric (speed grade -4).
Manufacturer
- Manufacturer: Xilinx, Inc. (now part of AMD)
- What kind of company: A U.S. semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related tools/IP), plus other programmable computing solutions.
- What kind of company: A U.S. semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related tools/IP), plus other programmable computing solutions.
Application
Typical application areas for XC3S1500-4FG676C (Spartan-3 FPGA):
- Digital signal processing, filtering and DSP blocks
- High-speed I/O, data acquisition and custom protocol controllers
- Embedded control, motor drives, robotics and PLC-like apps
- Communications baseband/PHY prototyping and networking interfaces
- Video/image processing and hardware acceleration
- Instrumentation, test & measurement, data logging
- Prototyping, education and research projects
- Industrial automation, sensor processing and embedded systems
- Digital signal processing, filtering and DSP blocks
- High-speed I/O, data acquisition and custom protocol controllers
- Embedded control, motor drives, robotics and PLC-like apps
- Communications baseband/PHY prototyping and networking interfaces
- Video/image processing and hardware acceleration
- Instrumentation, test & measurement, data logging
- Prototyping, education and research projects
- Industrial automation, sensor processing and embedded systems
Package
FineLine BGA package, 676-ball (FG676); Commercial temperature range (-C).
