仕様
| 属性 | 値 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Spartan®-3AN |
| Part Status | Active |
| Number of LABs/CLBs | 896 |
| Number of Logic Elements/Cells | 8064 |
| Total RAM Bits | 368640 |
| Number of I/O | 195 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概要
Description
XC3S400AN-4FTG256C is a Xilinx Spartan-3A FPGA. It’s a mid-density, cost-optimized device from the Spartan-3AN family, designed for DSP and control-oriented designs where moderate logic and I/O are needed. The “400” indicates about 400k logic cells (logic resources), while “AN” denotes the family variant. It comes in a 256-pin FineLine BGA package (FTG256C), offering a large number of user I/O pins. The device features LUT-based logic blocks with flip-flops, RAM resources (distributed and block RAM), and DSP/multiplier capabilities for DSP workloads, plus flexible clocking with PLLs. The -4 speed grade signals relatively strong performance for this family; actual timing depends on design and routing. Tool support includes Xilinx ISE/WebPACK for synthesis, mapping, and bitstream generation. In short, XC3S400AN-4FTG256C provides a balance of density, DSP capability, and low cost suitable for embedded control, data processing, and interfacing tasks on budget-conscious boards.
Features
Here are the main features of XC3S400AN-4FTG256C (Xilinx Spartan-3S):
- 400K logic cells (approximate capacity in Spartan-3S family)
- 256-pin Fine-TGFP (FTG256C) package
- Speed grade: -4 (fastest available for this device)
- 90 nm CMOS technology
- 3.3 V I/O with multiple I/O banks (mixed-voltage support; some banks may be 5V tolerant)
- On-chip memory: distributed RAM and block RAM resources
- DSP support: embedded multipliers for signal processing (integrated DSP elements)
- Clock management: clock distribution, DCMs/PLL options for phase alignment
- Reconfigurable fabric with JTAG and Slave Serial configuration; in-system programming
- Low-power options and wide operating temperature range (industrial variants)
- General-purpose I/O, flexible logic resources, and scalable interconnect
Note: exact counts of I/O pins, RAM blocks, and DSP slices vary by package and I/O configuration; consult the datasheet for precise numbers.
- 400K logic cells (approximate capacity in Spartan-3S family)
- 256-pin Fine-TGFP (FTG256C) package
- Speed grade: -4 (fastest available for this device)
- 90 nm CMOS technology
- 3.3 V I/O with multiple I/O banks (mixed-voltage support; some banks may be 5V tolerant)
- On-chip memory: distributed RAM and block RAM resources
- DSP support: embedded multipliers for signal processing (integrated DSP elements)
- Clock management: clock distribution, DCMs/PLL options for phase alignment
- Reconfigurable fabric with JTAG and Slave Serial configuration; in-system programming
- Low-power options and wide operating temperature range (industrial variants)
- General-purpose I/O, flexible logic resources, and scalable interconnect
Note: exact counts of I/O pins, RAM blocks, and DSP slices vary by package and I/O configuration; consult the datasheet for precise numbers.
Pinout
- Pin count: 256 pins (FTG256 package).
- Function: Xilinx Spartan-3AN FPGA device (≈400K logic cells), a programmable logic device for implementing digital circuits.
- Function: Xilinx Spartan-3AN FPGA device (≈400K logic cells), a programmable logic device for implementing digital circuits.
Manufacturer
Xilinx, Inc. It is an American multinational semiconductor company that designs and manufactures programmable logic devices (FPGAs and CPLDs) along with related software and IP.
Application
XC3S400AN-4FTG256C is a Spartan-3S FPGA with about 400K logic cells, suited for mid-density, cost-sensitive designs. Common application areas include:
- Embedded control and I/O interfacing (custom peripherals, state machines)
- Digital signal processing (filters, decimators, FFTs for moderate-scale DSP)
- Communications and networking (protocol engines, packet processing)
- Industrial automation and motor control (PWM, control loops, data acquisition)
- Instrumentation, test/measurement equipment
- Prototyping, education, and research platforms
- Embedded control and I/O interfacing (custom peripherals, state machines)
- Digital signal processing (filters, decimators, FFTs for moderate-scale DSP)
- Communications and networking (protocol engines, packet processing)
- Industrial automation and motor control (PWM, control loops, data acquisition)
- Instrumentation, test/measurement equipment
- Prototyping, education, and research platforms
Package
FTG256 — a 256‑pin Fine Pitch Quad Flat Pack (TQFP) package for the XC3S400AN device.