XC3S400AN-4FTG256C

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XC3S400AN-4FTG256C

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IC FPGA 195 I/O 256FTBGA

  • メーカーAMD ザイリンクス

  • メーカー品番 #XC3S400AN-4FTG256C

  • パッケージ LBGA-256

  • 在庫状況3476

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Supplier AMD Xilinx
Package / Case Tray
Series Spartan®-3AN
Part Status Active
Number of LABs/CLBs 896
Number of Logic Elements/Cells 8064
Total RAM Bits 368640
Number of I/O 195
Number of Gates 400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

概要

Description

XC3S400AN-4FTG256C is a Xilinx Spartan-3A FPGA. It’s a mid-density, cost-optimized device from the Spartan-3AN family, designed for DSP and control-oriented designs where moderate logic and I/O are needed. The “400” indicates about 400k logic cells (logic resources), while “AN” denotes the family variant. It comes in a 256-pin FineLine BGA package (FTG256C), offering a large number of user I/O pins. The device features LUT-based logic blocks with flip-flops, RAM resources (distributed and block RAM), and DSP/multiplier capabilities for DSP workloads, plus flexible clocking with PLLs. The -4 speed grade signals relatively strong performance for this family; actual timing depends on design and routing. Tool support includes Xilinx ISE/WebPACK for synthesis, mapping, and bitstream generation. In short, XC3S400AN-4FTG256C provides a balance of density, DSP capability, and low cost suitable for embedded control, data processing, and interfacing tasks on budget-conscious boards.

Features

Here are the main features of XC3S400AN-4FTG256C (Xilinx Spartan-3S):
- 400K logic cells (approximate capacity in Spartan-3S family)
- 256-pin Fine-TGFP (FTG256C) package
- Speed grade: -4 (fastest available for this device)
- 90 nm CMOS technology
- 3.3 V I/O with multiple I/O banks (mixed-voltage support; some banks may be 5V tolerant)
- On-chip memory: distributed RAM and block RAM resources
- DSP support: embedded multipliers for signal processing (integrated DSP elements)
- Clock management: clock distribution, DCMs/PLL options for phase alignment
- Reconfigurable fabric with JTAG and Slave Serial configuration; in-system programming
- Low-power options and wide operating temperature range (industrial variants)
- General-purpose I/O, flexible logic resources, and scalable interconnect
Note: exact counts of I/O pins, RAM blocks, and DSP slices vary by package and I/O configuration; consult the datasheet for precise numbers.

Pinout

- Pin count: 256 pins (FTG256 package).
- Function: Xilinx Spartan-3AN FPGA device (≈400K logic cells), a programmable logic device for implementing digital circuits.

Manufacturer

Xilinx, Inc. It is an American multinational semiconductor company that designs and manufactures programmable logic devices (FPGAs and CPLDs) along with related software and IP.

Application

XC3S400AN-4FTG256C is a Spartan-3S FPGA with about 400K logic cells, suited for mid-density, cost-sensitive designs. Common application areas include:
- Embedded control and I/O interfacing (custom peripherals, state machines)
- Digital signal processing (filters, decimators, FFTs for moderate-scale DSP)
- Communications and networking (protocol engines, packet processing)
- Industrial automation and motor control (PWM, control loops, data acquisition)
- Instrumentation, test/measurement equipment
- Prototyping, education, and research platforms

Package

FTG256 — a 256‑pin Fine Pitch Quad Flat Pack (TQFP) package for the XC3S400AN device.

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