仕様
| 属性 | 値 |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Virtex®-5 LX |
| Part Status | Active |
| Number of LABs/CLBs | 6480 |
| Number of Logic Elements/Cells | 82944 |
| Total RAM Bits | 3538944 |
| Number of I/O | 440 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概要
Description
XC5VLX85-1FF676C is a Virtex-5 LX family FPGA from Xilinx. It targets mid-to-high density digital designs with substantial parallel logic the ability to implement complex RTL.
Key points:
- 85k logical cells (approximate feature for the LX85)
- Package: FF676 (676-pin flip-chip BGA)
- Speed grade: -1 (fast timing)
- Temperature: Commercial (C) grade
- Built-in resources typically include logic, block RAM, DSP blocks, and clock-management tiles/PLLs; broad I/O banks for versatile interfacing
Typical uses:
- High-speed signal processing, communications, video/data processing, and hardware acceleration
Note:
- Exact resource counts (LUTs, RAM blocks, DSP slices, I/O) vary by device revision. Refer to the Xilinx datasheet and packaging guide for precise specs.
Key points:
- 85k logical cells (approximate feature for the LX85)
- Package: FF676 (676-pin flip-chip BGA)
- Speed grade: -1 (fast timing)
- Temperature: Commercial (C) grade
- Built-in resources typically include logic, block RAM, DSP blocks, and clock-management tiles/PLLs; broad I/O banks for versatile interfacing
Typical uses:
- High-speed signal processing, communications, video/data processing, and hardware acceleration
Note:
- Exact resource counts (LUTs, RAM blocks, DSP slices, I/O) vary by device revision. Refer to the Xilinx datasheet and packaging guide for precise specs.
Features
XC5VLX85-1FF676C features (concise):
- Virtex-5 LX architecture with about 85K logic cells
- 676-pin FF676 package (ball-grid array)
- Speed grade -1
- Large on-chip resources: hundreds of 36Kb BRAM blocks and hundreds of DSP48A1 slices
- High-speed serial I/O: RocketIO/GTx-style transceivers for multi-Gbps SERDES
- Flexible clocking: multiple PLLs/DCMs for complex timing networks
- I/O banks: numerous 3.3V-tolerant I/O with configurable Vcco; 1.2V core
- Support for in-system reconfiguration and JTAG boundary scan
- Optimized for dense, high-performance digital designs with robust power/thermal characteristics
- Virtex-5 LX architecture with about 85K logic cells
- 676-pin FF676 package (ball-grid array)
- Speed grade -1
- Large on-chip resources: hundreds of 36Kb BRAM blocks and hundreds of DSP48A1 slices
- High-speed serial I/O: RocketIO/GTx-style transceivers for multi-Gbps SERDES
- Flexible clocking: multiple PLLs/DCMs for complex timing networks
- I/O banks: numerous 3.3V-tolerant I/O with configurable Vcco; 1.2V core
- Support for in-system reconfiguration and JTAG boundary scan
- Optimized for dense, high-performance digital designs with robust power/thermal characteristics
Pinout
- Pin count: 676 pins (FF676 package)
- Function: Xilinx Virtex-5 LX85 FPGA (field-programmable gate array) – a high-performance, reconfigurable logic device with DSP slices and block RAM for implementing digital circuits.
- Function: Xilinx Virtex-5 LX85 FPGA (field-programmable gate array) – a high-performance, reconfigurable logic device with DSP slices and block RAM for implementing digital circuits.
Manufacturer
- Manufacturer: Xilinx, Inc. (now part of AMD)
- What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs, along with related IP, tools, and systems.
- What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs, along with related IP, tools, and systems.
Application
XC5VLX85-1FF676C is a Virtex-5 LX FPGA suited for DSP-intensive, high-speed applications. Common areas include:
- Telecommunications and baseband processing (wireless/wired transceivers, channel coding)
- Real-time video/image/audio processing and encoding/decoding
- High-speed data acquisition, instrumentation, and test/measurement
- Networking and data-center interfaces (high-speed SERDES, PCIe endpoints)
- Aerospace/defense signal processing (radar, ELINT)
- Industrial automation, control, and rapid algorithm prototyping/acceleration
- Telecommunications and baseband processing (wireless/wired transceivers, channel coding)
- Real-time video/image/audio processing and encoding/decoding
- High-speed data acquisition, instrumentation, and test/measurement
- Networking and data-center interfaces (high-speed SERDES, PCIe endpoints)
- Aerospace/defense signal processing (radar, ELINT)
- Industrial automation, control, and rapid algorithm prototyping/acceleration
Package
FBGA (flip-chip ball-grid array) package with 676 balls (676-ball package), RoHS-compliant variant.
