仕様
| 属性 | 値 |
| Package | Tray |
| Series | Spartan®-6 LXT |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3411 |
| NumberofLogicElements/Cells | 43661 |
| TotalRAMBits | 2138112 |
| NumberofI/O | 190 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
概要
Description
The XC6SLX45T-3CSG324I is a member of Xilinx's Spartan-6 FPGA family, designed for cost-sensitive, high-performance applications. Key features:
- Logic Capacity: 43,661 logic cells.
- Package: 324-ball CSG (Chip-Scale BGA) for compact designs.
- Speed Grade: -3 (moderate performance).
- I/O Pins: Supports up to 250 user I/Os with versatile voltage standards (LVCMOS, LVDS, etc.).
- On-Chip Resources: Includes DSP slices, block RAM (2,088 Kb), and clock management (DCM, PLL).
- Applications: Embedded systems, industrial control, communications, and consumer electronics.
The "T" denotes a thin package variant, suitable for space-constrained designs. It balances power efficiency (~1W typical) with moderate speed, making it ideal for mid-range FPGA applications.
For detailed specs, refer to Xilinx’s Spartan-6 Family Overview and DS160 datasheet.
- Logic Capacity: 43,661 logic cells.
- Package: 324-ball CSG (Chip-Scale BGA) for compact designs.
- Speed Grade: -3 (moderate performance).
- I/O Pins: Supports up to 250 user I/Os with versatile voltage standards (LVCMOS, LVDS, etc.).
- On-Chip Resources: Includes DSP slices, block RAM (2,088 Kb), and clock management (DCM, PLL).
- Applications: Embedded systems, industrial control, communications, and consumer electronics.
The "T" denotes a thin package variant, suitable for space-constrained designs. It balances power efficiency (~1W typical) with moderate speed, making it ideal for mid-range FPGA applications.
For detailed specs, refer to Xilinx’s Spartan-6 Family Overview and DS160 datasheet.
Equivalent
Equivalent products to the XC6SLX45T-3CSG324I (Spartan-6 FPGA) include:
- Xilinx Artix-7 (e.g., XC7A50T) – newer, lower power, higher performance.
- Lattice ECP5 (e.g., LFE5UM-45F) – lower-cost alternative.
- Intel (Altera) Cyclone IV (e.g., EP4CE30) – comparable density.
For direct replacements, check XC6SLX45T variants (e.g., speed grades or packages like XC6SLX45T-2/3FGG484I). Verify compatibility based on design requirements.
- Xilinx Artix-7 (e.g., XC7A50T) – newer, lower power, higher performance.
- Lattice ECP5 (e.g., LFE5UM-45F) – lower-cost alternative.
- Intel (Altera) Cyclone IV (e.g., EP4CE30) – comparable density.
For direct replacements, check XC6SLX45T variants (e.g., speed grades or packages like XC6SLX45T-2/3FGG484I). Verify compatibility based on design requirements.
Pinout
The XC6SLX45T-3CSG324I is a Spartan-6 FPGA with:
- 324-pin package (CSG324, 15x15mm, 0.8mm pitch).
- Functions:
- User I/Os: 232 (supports LVCMOS, LVDS, and other standards).
- Logic Cells: 43,661.
- DSP Slices: 58.
- Block RAM: 2,088 Kb.
- Clock Management: 4 DCMs, 2 PLLs.
- High-speed interfaces: Supports GTP transceivers (up to 3.2 Gbps).
- Applications: Embedded, communications, and industrial control.
Package is RoHS-compliant (lead-free).
- 324-pin package (CSG324, 15x15mm, 0.8mm pitch).
- Functions:
- User I/Os: 232 (supports LVCMOS, LVDS, and other standards).
- Logic Cells: 43,661.
- DSP Slices: 58.
- Block RAM: 2,088 Kb.
- Clock Management: 4 DCMs, 2 PLLs.
- High-speed interfaces: Supports GTP transceivers (up to 3.2 Gbps).
- Applications: Embedded, communications, and industrial control.
Package is RoHS-compliant (lead-free).
Manufacturer
The XC6SLX45T-3CSG324I is manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx is a leading semiconductor company specializing in field-programmable gate arrays (FPGAs), adaptive SoCs, and related development tools. Known for innovation in reconfigurable computing, its products are widely used in telecommunications, automotive, aerospace, and data centers.
The XC6SLX45T is part of the Spartan-6 family, a cost-optimized FPGA series for high-volume applications. The -3CSG324I suffix indicates speed grade, package (CSG324), and industrial temperature range.
AMD’s acquisition strengthened its position in adaptive computing, integrating Xilinx’s FPGA expertise with its CPU/GPU offerings.
Xilinx is a leading semiconductor company specializing in field-programmable gate arrays (FPGAs), adaptive SoCs, and related development tools. Known for innovation in reconfigurable computing, its products are widely used in telecommunications, automotive, aerospace, and data centers.
The XC6SLX45T is part of the Spartan-6 family, a cost-optimized FPGA series for high-volume applications. The -3CSG324I suffix indicates speed grade, package (CSG324), and industrial temperature range.
AMD’s acquisition strengthened its position in adaptive computing, integrating Xilinx’s FPGA expertise with its CPU/GPU offerings.
Application
The XC6SLX45T-3CSG324I, a Spartan-6 FPGA, is used in:
- Embedded Systems – For control and interfacing.
- Industrial Automation – Motor control, PLCs, and sensors.
- Communications – Protocol bridging and signal processing.
- Consumer Electronics – Display controllers and multimedia.
- Medical Devices – Portable diagnostics and imaging.
- Automotive – ADAS and infotainment.
- Aerospace & Defense – Avionics and secure comms.
Its low power, moderate logic density, and cost-effectiveness make it ideal for these applications.
- Embedded Systems – For control and interfacing.
- Industrial Automation – Motor control, PLCs, and sensors.
- Communications – Protocol bridging and signal processing.
- Consumer Electronics – Display controllers and multimedia.
- Medical Devices – Portable diagnostics and imaging.
- Automotive – ADAS and infotainment.
- Aerospace & Defense – Avionics and secure comms.
Its low power, moderate logic density, and cost-effectiveness make it ideal for these applications.
Package
The XC6SLX45T-3CSG324I is a Spartan-6 FPGA from Xilinx, packaged in a 324-ball CSG (Fine-Pitch Ball Grid Array). It has a 0.8mm ball pitch, RoHS compliance, and is designed for industrial temperature range (-40°C to +100°C). The package supports high-speed I/O and is commonly used in embedded and cost-sensitive applications.
