仕様
| 属性 | 値 |
| Package / Case | Tray |
| Series | Spartan®-6 LX |
| Part Status | Active |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 280 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
概要
Equivalent
The XC6SLX75-3FGG484C is a Spartan-6 FPGA. Equivalent alternatives include:
- Lattice ECP5 (e.g., LFE5UM-85F-8BG381C)
- Intel (Altera) Cyclone IV (e.g., EP4CE75F23C8N)
- Microsemi (Microchip) SmartFusion2 (e.g., M2S090-FGG484)
These offer similar logic capacity (~75K LUTs) and package compatibility (484-pin BGA). Choose based on power, performance, and ecosystem preferences.
- Lattice ECP5 (e.g., LFE5UM-85F-8BG381C)
- Intel (Altera) Cyclone IV (e.g., EP4CE75F23C8N)
- Microsemi (Microchip) SmartFusion2 (e.g., M2S090-FGG484)
These offer similar logic capacity (~75K LUTs) and package compatibility (484-pin BGA). Choose based on power, performance, and ecosystem preferences.
Pinout
The XC6SLX75-3FGG484C is a Spartan-6 FPGA with the following key details:
- Pin Count: 484 (Fine-pitch Ball Grid Array, FGG484 package)
- Core Logic: 74,637 logic cells, optimized for cost-sensitive applications.
- I/O Pins: 296 user I/Os (supports multiple standards: LVCMOS, LVDS, etc.).
- Speed Grade: -3 (moderate performance).
- Features:
- DSP slices, block RAM (2,268 Kb), clock management (DCM, PLL).
- Supports PCIe, Gigabit Ethernet, and other high-speed interfaces.
Primary Use: Embedded systems, industrial control, communications, and consumer electronics.
- Pin Count: 484 (Fine-pitch Ball Grid Array, FGG484 package)
- Core Logic: 74,637 logic cells, optimized for cost-sensitive applications.
- I/O Pins: 296 user I/Os (supports multiple standards: LVCMOS, LVDS, etc.).
- Speed Grade: -3 (moderate performance).
- Features:
- DSP slices, block RAM (2,268 Kb), clock management (DCM, PLL).
- Supports PCIe, Gigabit Ethernet, and other high-speed interfaces.
Primary Use: Embedded systems, industrial control, communications, and consumer electronics.
Manufacturer
The XC6SLX75-3FGG484C is a Spartan-6 series FPGA (Field-Programmable Gate Array) manufactured by Xilinx, now part of AMD following its acquisition in 2022.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and adaptive computing solutions. Known for innovation in reconfigurable hardware, Xilinx serves industries like telecommunications, automotive, aerospace, and data centers.
The XC6SLX75-3FGG484C is a mid-range FPGA with 74,637 logic cells, designed for cost-sensitive, high-performance applications. The "FGG484" denotes a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.
Xilinx (now AMD) is a leading semiconductor company specializing in programmable logic devices, including FPGAs, SoCs, and adaptive computing solutions. Known for innovation in reconfigurable hardware, Xilinx serves industries like telecommunications, automotive, aerospace, and data centers.
The XC6SLX75-3FGG484C is a mid-range FPGA with 74,637 logic cells, designed for cost-sensitive, high-performance applications. The "FGG484" denotes a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.
Application
The XC6SLX75-3FGG484C, a Spartan-6 FPGA, is used in:
- Embedded Systems: For control and interfacing in industrial, automotive, and consumer electronics.
- Communications: In networking, signal processing, and protocol bridging.
- Medical Devices: For real-time data acquisition and processing.
- Military/Aerospace: In rugged, high-reliability applications.
- Video & Imaging: For HD video processing and camera interfaces.
- IoT & Edge Computing: Enabling low-power, high-performance edge processing.
Its balance of cost, power efficiency, and performance makes it ideal for mid-range FPGA applications.
- Embedded Systems: For control and interfacing in industrial, automotive, and consumer electronics.
- Communications: In networking, signal processing, and protocol bridging.
- Medical Devices: For real-time data acquisition and processing.
- Military/Aerospace: In rugged, high-reliability applications.
- Video & Imaging: For HD video processing and camera interfaces.
- IoT & Edge Computing: Enabling low-power, high-performance edge processing.
Its balance of cost, power efficiency, and performance makes it ideal for mid-range FPGA applications.
Package
The XC6SLX75-3FGG484C is a Spartan-6 FPGA from Xilinx. It comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package (FGG484). The "FGG" denotes the package type (Flip-Chip Fine-Pitch BGA), and "484" indicates the pin count. This package is designed for high-density, high-performance applications with a compact footprint.
