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XC7S75-2FGGA676I
+BOMIC FPGA 400 I/O 676FPBGA
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メーカーAMD
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メーカー品番 #XC7S75-2FGGA676I
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在庫状況3351
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | Spartan®-7 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 76800 |
| Total RAM Bits | 4331520 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FPBGA (27x27) |
| Base Product Number | XC7S75 |
| Number of LA Bs / CL Bs | 6000 |
概要
Description
Key features include advanced power management capabilities, up to 1.2 Mbits of block RAM, and an array of digital signal processing (DSP) slices for efficient signal manipulation. The 676-ball Fine Pitch Ball Grid Array (FBGA) package provides a compact and reliable form factor suitable for space-constrained designs.
The Spartan-7 series is well-suited for applications in automotive, industrial, and consumer electronics, leveraging Xilinx's Vivado Design Suite for development, which simplifies design, verification, and implementation. Overall, the XC7S75-2FGGA676I serves as an effective solution for engineers seeking flexibility and performance in their FPGA designs.
Equivalent
1. XC7S100 - Higher logic resources.
2. XC7S50 - Lower logic resources.
3. Lattice ICE40 - A lower-power alternative.
4. Intel MAX 10 - For similar applications, though with different architecture.
For direct comparisons, consider specific requirements like I/O count, power consumption, and application needs.
Features
1. Logic Cells: Contains 75K logic cells with a flexible architecture for complex designs.
2. DSP Slices: Offers 30 DSP slices for efficient digital signal processing.
3. Block RAM: Includes up to 4.9 Mb of block RAM for data storage.
4. I/O Pins: Provides 676 I/O pins with support for various I/O standards, enabling interface flexibility.
5. Speed Grade: Operates at speed grade -2, ensuring reliable performance.
6. Power Efficiency: Designed for low power consumption, making it ideal for battery-operated devices.
7. Configuration Options: Supports various configuration methods, including JTAG and SPI.
8. Embedded Features: Supports embedded system design with integrated clock management and system monitoring.
This FPGA is suitable for applications in automotive, industrial control, and consumer electronics, offering a balance of performance and cost.
Pinout
The primary functions of the XC7S75 include providing programmable logic resources, digital signal processing capabilities, and I/O interfaces. It supports a wide range of I/O standards and configurations, making it suitable for various applications, including embedded systems, communications, and image processing. The device features up to 75,000 logic cells, allowing for complex designs and a versatile range of applications.
Key features include:
- 676 package pins
- 75,000 logic cells
- Multiple I/O configurations and standards
- Integrated block RAM and DSP slices
Overall, the XC7S75 is designed to deliver performance, power efficiency, and flexibility for a variety of digital design tasks.
Manufacturer
Application
1. Embedded Systems: For real-time processing and control tasks.
2. Industrial Automation: In factory automation, robotics, and motor control.
3. Consumer Electronics: For video processing and signal acceleration.
4. Automotive: In advanced driver-assistance systems (ADAS) and infotainment.
5. Communications: Enabling data processing in telecommunications and networking.
6. Medical Devices: For imaging and diagnostic equipment.
Its low power consumption and cost-effectiveness make it suitable for these diverse applications.