画像は参考用です
XCVU19P-1FSVA3824E
+BOMIC FPGA VIRTEX-UP 3824FCBGA
-
メーカーAMD
-
メーカー品番 #XCVU19P-1FSVA3824E
-
在庫状況7568
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 8937600 |
| Total RAM Bits | 79586918 |
| Number of I/O | 2072 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 3824-BBGA, FCBGA |
| Supplier Device Package | 3824-FCBGA (65x65) |
| Number of LA Bs / CL Bs | 510720 |
概要
Description
Key specifications include:
- Logic Cells: Offers a high count of programmable logic resources, enabling complex designs.
- DSP Slices: Optimized for high-performance digital signal processing tasks.
- Memory: Integrated memory resources for efficient data handling and storage.
- Connectivity: Supports high-speed I/O interfaces for seamless communication.
- Application: Ideal for data centers, AI, machine learning, and 5G infrastructure.
The XCVU19P is designed for applications requiring dynamic reconfiguration and high throughput, making it suitable for various industries. Its advanced features provide scalability and flexibility, allowing developers to optimize performance for specific workloads. Overall, the XCVU19P-1FSVA3824E is a powerful choice for modern computational demands.
Equivalent
Features
1. Architecture: Utilizes advanced 16nm FinFET technology, providing enhanced performance and energy efficiency.
2. Logic Cells: Approximately 1.5 million logic cells, enabling complex designs and high-density applications.
3. DSP Slices: Features over 5,000 DSP slices for high-speed arithmetic operations, suitable for signal processing tasks.
4. Memory: Includes significant on-chip memory resources, such as Block RAM and UltraRAM, supporting large data sets and caching.
5. I/O: Offers a wide variety of I/O standards with high-speed transceivers supporting data rates up to 58 Gbps.
6. Scalability: Ideal for applications in data centers, AI, and machine learning, with scalable architecture to meet diverse needs.
7. Power Management: Advanced power management features for optimized energy consumption.
Overall, the XCVU19P-1FSVA3824E is designed for demanding applications requiring high performance, flexibility, and efficiency.
Pinout
Manufacturer
Xilinx specializes in providing programmable logic devices that enable engineers to create customized hardware solutions for a variety of applications, including data centers, automotive, telecommunications, aerospace, and industrial sectors. The XCVU19P-1FSVA3824E is part of the Versal ACAP (Adaptive Compute Acceleration Platform) family, which integrates several processing engines and a high degree of adaptability to meet diverse computational needs. This makes Xilinx a key player in the semiconductor industry, particularly in fields that require high-performance computing and flexibility.
Application
1. Data Centers: Accelerating data processing and storage.
2. Networking: Enhancing packet processing and network functions virtualization (NFV).
3. Machine Learning: Implementing AI inference and training acceleration.
4. High-Performance Computing (HPC): Supporting complex simulations and calculations.
5. Broadcasting: Real-time video processing and encoding.
6. Aerospace and Defense: Enabling secure, flexible, and high-speed processing for critical applications.
7. Automotive: Assisting in advanced driver-assistance systems (ADAS) and autonomous driving solutions.
These applications leverage the chip’s high logic density, bandwidth, and processing capabilities.