XCZU3EG-1SBVA484E

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XCZU3EG-1SBVA484E

+BOM

IC SOC CORTEX-A53 484FCBGA

  • メーカーAMD

  • メーカー品番 #XCZU3EG-1SBVA484E

  • 在庫状況3745

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Series Zynq® UltraScale+™ MPSOC EG
Part Status Active
Base Product Number XCZU3
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 484-BFBGA, FCBGA
Supplier Device Package 484-FCBGA (19x19)
Packaging Tray

概要

Description

XCZU3EG-1SBVA484E is a Xilinx Zynq UltraScale+ MPSoC device (ZU3EG family) that combines a quad‑core ARM Cortex‑A53 processing system with programmable logic (FPGA) on a single die. The “-1” denotes the speed grade, and “SBVA484E” indicates a 484‑ball BGA package with SBVA pinout and E temperature grade. This device is designed for embedded applications that need both software execution and hardware acceleration, such as vision, automation, and communications systems. It provides integrated PS/PL connectivity (AXI, memory controllers, high‑speed transceivers, PCIe, USB, Gigabit Ethernet, etc.), along with security and reliability features typical of Zynq UltraScale+ devices. Development is done with Xilinx tools (Vivado/Vitis). For exact specifications—logic capacity, I/O counts, PS/PL interfaces, transceiver performance, and memory options—consult the official Xilinx Product Guide and Datasheet for XCZU3EG-1SBVA484E.

Equivalent

Do you mean identical cross‑reference part numbers (same ZU3EG device/package), drop‑in replacements from other vendors, or functionally similar MPSoCs? Please clarify so I can give the correct concise equivalents.

Features

Key features of XCZU3EG-1SBVA484E (Zynq UltraScale+ MPSoC):
- Zynq UltraScale+ MPSoC device with APU quad-core ARM Cortex-A53 and RPU dual-core ARM Cortex-R5 for real-time tasks
- Rich Programmable Logic (PL) fabric with LUTs/FFs, DSP slices, BRAM/URAM for custom logic
- High-bandwidth interconnect between CPU(s) and PL for low-latency data sharing
- Multi-channel high-speed transceivers in the PL for I/O and protocol support
- Memory interfaces with DDR4/LPDDR4 support and related controllers
- Integrated peripherals: USB, Gigabit Ethernet, PCIe, CAN, I2C, SPI, UART (peripheral set varies by package)
- Security features: hardened cryptographic engine, secure boot and root-of-trust capabilities
- 484-ball BGA (SBVA) package with -1 speed grade
- Suitable for applications requiring embedded processing + programmable logic in a single device
Note: exact I/O counts, memory/controller specifics, and transceiver speeds depend on the exact board/variant.

Pinout

XCZU3EG-1SBVA484E is a 484-pin device (SBVA484E package). It is a Xilinx (AMD) Zynq UltraScale+ MPSoC: a hybrid SoC+FPGA that combines programmable logic (FPGA fabric) with an ARM-based processing system (quad‑core 64‑bit Cortex‑A53 application cores, dual‑core Cortex‑R5 real‑time processors and Mali GPU on typical MPSoC family members), plus integrated memory controllers, high‑speed transceivers and peripherals (DDR, PCIe, Ethernet, USB, SD/eMMC, MIO, etc.).

Manufacturer

Manufacturer: Xilinx (now part of Advanced Micro Devices, Inc. — AMD).
Type of company: a fabless semiconductor and technology company that designs programmable logic devices (FPGAs), system-on-chips (Zynq UltraScale+ MPSoCs), and adaptive/accelerator solutions for communications, automotive, aerospace/defense, and data-center applications.

Application

XCZU3EG-1SBVA484E is a Zynq UltraScale+ MPSoC device (ARM cores + FPGA fabric). Common application areas include:
- Industrial automation and robotics (real-time control, vision-based inspection)
- Automotive (ADAS, cockpit/in-vehicle gateways)
- Embedded vision and imaging (cameras, medical imaging, surveillance analytics)
- Communications and networking equipment (edge routers, high-speed data processing)
- Aerospace/defense embedded systems (rugged, reliable compute)
- Edge AI and sensor fusion (AI inference and real-time data processing at the edge)

Package

XCZU3EG-1SBVA484E is supplied in a 484-ball fine-pitch BGA package (package code BVA484, often referenced as FBGA484).

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