5CEBA2F23C8N
インテル
- Lifecycle
- Active
- Stock
- 2918 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
5CEBA2F23C8Nと5CEBA4F23C7Nの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 5CEBA4F23C7N and 5CEBA2F23C8N are both Intel Cyclone V F23 package FPGA devices sharing identical I/O count, package footprint, and supply voltage requirements, making them strong functional replacement candidates. The primary differentiators are logic density and speed grade, which directly affect resource availability and timing closure. Designers must validate that the reduced logic array of the 5CEBA2F23C8N accommodates their design's resource requirements and that the faster C8 speed grade meets timing margins before committing to a drop-in substitution.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F23C7N | 5CEBA2F23C8N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 49000 | 25000 | Logic capacity determines how much custom digital logic can be implemented; a design that fits one device may not fit the other. |
| Total RAM Bits | 3036160 | 1382400 | Embedded memory affects buffering, FIFO depth, and data storage capability; insufficient RAM can prevent a design from fitting. |
| Embedded Multipliers (18x18) | 132 | 66 | DSP blocks are required for efficient multiplication and signal processing; fewer multipliers limit arithmetic throughput. |
| Maximum User I/O | 224 | 224 | I/O count determines how many external signals can be interfaced; both devices offer the same I/O in this package. |
| Speed Grade | 7 | 8 | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet performance targets. |
| Package | FBGA-484 | FBGA-484 | Package must match the PCB footprint for physical compatibility; both use the same 484-ball fine-pitch BGA. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature range determines suitability for the target environment; both are commercial-grade devices. |
| Core Supply Voltage | 1.1 V | 1.1 V | Core voltage must match the board power design; both devices share the same nominal core supply. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA2F23C8N | 5CEBA4F23C7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 18480 |
| Number of Logic Elements/Cells | 25000 | 49000 |
| Total RAM Bits | 2002944 | 3464192 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEBA4F23C7N and 5CEBA2F23C8N are both Intel (formerly Altera) Cyclone V E FPGA devices in the same 484-pin FBGA package (23 mm x 23 mm). The primary differences are logic density and speed grade: the 5CEBA4F23C7N offers approximately 49,000 logic elements (LEs) with a speed grade of 7, while the 5CEBA2F23C8N offers approximately 25,000 LEs with a speed grade of 8. The 5CEBA4F23C7N also provides more embedded memory, multipliers, and transceiver channels than the 5CEBA2F23C8N.
Yes. Both devices are offered in the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by Intel for the Cyclone V E family. This means they share the same PCB footprint and pin functions, allowing a board designed for one device to potentially accept the other, provided the design's logic, power, and timing requirements are revalidated.
No, not as a direct drop-in replacement without design changes. Although they are pin-compatible, the 5CEBA2F23C8N has lower logic density (approximately 25,000 LEs vs. 49,000 LEs) and a different speed grade (8 vs. 7). A design that fully utilizes the 5CEBA4F23C7N's resources may not fit or meet timing in the 5CEBA2F23C8N. The FPGA configuration bitstream is also device-specific and must be regenerated for the target device.
The 5CEBA4F23C7N has a speed grade of 7, while the 5CEBA2F23C8N has a speed grade of 8. In Intel's Cyclone V naming convention, a lower speed grade number indicates a faster device. Therefore, the 5CEBA4F23C7N (speed grade 7) offers faster maximum operating frequencies and tighter timing performance than the 5CEBA2F23C8N (speed grade 8), assuming equivalent logic usage.
Yes. Both the 5CEBA4F23C7N and 5CEBA2F23C8N support the same configuration schemes as part of the Cyclone V E family, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. However, the configuration bitstream file (.sof or .rbf) is specific to each device and cannot be interchanged.
The 5CEBA4F23C7N, with its higher logic density and faster speed grade, is suited for more complex applications such as industrial motor control, image processing, and communication bridging that require additional logic resources and higher performance. The 5CEBA2F23C8N, with lower density and a slower speed grade, is typically used in cost-sensitive, lower-complexity designs such as simple protocol conversion, basic human-machine interfaces, and low-end embedded control where fewer logic resources are sufficient.
Yes. Both the 5CEBA4F23C7N and 5CEBA2F23C8N belong to the Cyclone V E family and share the same core voltage (typically 1.1 V) and I/O voltage ranges as specified in the Intel Cyclone V Device Handbook. They support the same I/O standards, including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, provided the respective I/O banks are powered and configured correctly.
In general, yes. The 5CEBA4F23C7N has a higher logic density and a faster speed grade, which typically results in higher static and dynamic power consumption compared to the 5CEBA2F23C8N under similar operating conditions. Actual power consumption depends on the specific design's resource utilization, clock frequencies, and I/O activity, and should be estimated using Intel's Early Power Estimator (EPE) or PowerPlay Power Analyzer tools.