Part A
5CEBA4F23C7N
インテル
- Lifecycle
- Active
- Stock
- 1344 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 5CEBA4U15C6N is a viable functional replacement candidate for the 5CEBA4F23C7N, sharing the same Cyclone V E logic density, transceiver count, and core architecture, but designers must validate package footprint, I/O count, and speed grade differences before committing to a drop-in substitution.
Logic Density
High match
Package Type
Validation required
I/O Count
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
5CEBA4U15C6N
インテル
- Lifecycle
- Active
- Stock
- 8629 個数
- Package
- LFBGA-324
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F23C7N | 5CEBA4U15C6N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-484 | UBGA-324 | The physical footprint and ball pitch differ, so the two devices are not drop-in compatible on the same PCB. |
| Number of Logic Elements (LE) | 49000 | 49000 | Logic capacity determines the amount of user logic that can be implemented; identical LE count supports similar design complexity. |
| Total RAM Bits | 3036160 | 3036160 | Embedded memory affects buffering, FIFO depth, and data storage capability within the FPGA fabric. |
| Number of I/Os | 224 | 176 | Available I/O count limits external interfacing; fewer I/Os may restrict peripheral connectivity. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for commercial versus industrial or automotive environments. |
| Speed Grade | 7 | 6 | Speed grade affects maximum operating frequency and timing closure; a faster grade may be required for high-performance designs. |
| Supply Voltage - Core | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values allow reuse of the same power rail. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style determines assembly process compatibility; both being SMD supports standard reflow soldering. |
| RoHS Status | RoHS Compliant | RoHS Compliant | RoHS compliance is required for sale in many regions and affects material selection and disposal regulations. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F23C7N | 5CEBA4U15C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 18480 |
| Number of Logic Elements/Cells | 49000 | 49000 |
| Total RAM Bits | 3464192 | 3464192 |
| Number of I/O | 224 | 176 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA4F23C7N and 5CEBA4U15C6N devices?
Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs). The 5CEBA4F23C7N is a 23 mm FBGA-packaged device, while the 5CEBA4U15C6N is a 15 mm UBGA-packaged device. Both share the same 5CEBA4 core logic density and belong to the Cyclone V E family.
What is the difference in package type and pin count between the 5CEBA4F23C7N and 5CEBA4U15C6N?
The 5CEBA4F23C7N uses a 484-pin FineLine BGA (FBGA) package with a 23 mm body size. The 5CEBA4U15C6N uses a 324-pin Ultra FineLine BGA (UBGA) package with a 15 mm body size. The different packages result in different pin counts, ball maps, and PCB footprint requirements.
Do the 5CEBA4F23C7N and 5CEBA4U15C6N have the same logic density and resources?
Yes. Both devices are based on the same Cyclone V E 5CEBA4 die, so they share the same core logic resources, including adaptive logic modules (ALMs), embedded memory blocks, and DSP blocks. The primary differences are package, pin count, and available user I/O.
What does the speed grade suffix indicate for these two devices?
The 5CEBA4F23C7N has a speed grade of 7 (C7), while the 5CEBA4U15C6N has a speed grade of 6 (C6). In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 5CEBA4U15C6N (C6) offers higher performance than the 5CEBA4F23C7N (C7).
Are the 5CEBA4F23C7N and 5CEBA4U15C6N pin-to-pin compatible?
No. The 5CEBA4F23C7N is a 484-pin FBGA (23 mm) and the 5CEBA4U15C6N is a 324-pin UBGA (15 mm). They have different pin counts, ball pitches, and footprints, so they are not pin-to-pin compatible and cannot be interchanged without a PCB redesign.
Can the 5CEBA4U15C6N be used as a direct drop-in replacement for the 5CEBA4F23C7N?
No. Because the two devices differ in package type, pin count, and speed grade, a direct drop-in replacement is not possible. Any substitution requires a new PCB layout, updated pin assignments, and timing re-validation for the target design.
What are the typical applications for these Cyclone V E FPGAs?
Cyclone V E FPGAs are typically used in industrial automation, motor control, video and image processing, communication infrastructure, and embedded systems where a balance of logic density, power efficiency, and cost is required. The 5CEBA4F23C7N and 5CEBA4U15C6N are suitable for similar applications, but the smaller 15 mm UBGA package of the 5CEBA4U15C6N is better suited to space-constrained designs.
Which device offers more user I/O pins?
The 5CEBA4F23C7N, with its larger 484-pin FBGA package, provides more user I/O pins than the 5CEBA4U15C6N, which is limited to 324 pins in the smaller UBGA package. The exact number of user I/O pins should be confirmed from the respective Intel Cyclone V device pin-out files.