5CEBA2F23C8N vs 5CEBA7F23C8N

5CEBA2F23C8Nと5CEBA7F23C8Nの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Not a drop-in replacement

The 5CEBA7F23C8N and 5CEBA2F23C8N are both Intel Cyclone V FPGA devices in the same FBGA-484 package and share an identical I/O and transceiver count, but they differ fundamentally in logic density, embedded memory, and multiplier resources. The 5CEBA7F23C8N offers roughly three times the logic elements and more than three times the embedded memory of the 5CEBA2F23C8N, making them functionally non-interchangeable for designs that rely on the larger device's capacity. The 5CEBA2F23C8N can only serve as a substitute where the reduced logic, memory, and DSP resources are sufficient, and even then a full recompile and timing closure are mandatory.

Different logic density Different embedded memory Different DSP resources Recompile required

Parts at a glance

Part A

5CEBA2F23C8N

インテル

Lifecycle
Active
Stock
2918 個数
Package
FBGA-484
Series
組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
Part B

5CEBA7F23C8N

インテル

Lifecycle
Active
Stock
6287 個数
Package
FBGA-484
Series
組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEBA7F23C8N 5CEBA2F23C8N Why it matters
Logic Elements (LE) 150,000 25,000 Logic capacity determines the maximum complexity of digital designs the FPGA can implement; a large difference means the two parts are not functionally substitutable for most designs.
Total Embedded Memory 6,912 kbit 1,080 kbit On-chip memory limits buffering, FIFO depth, and data storage; a smaller device may not fit designs that rely on large embedded RAM blocks.
Embedded 18x18 Multipliers 312 66 DSP blocks are essential for arithmetic-intensive applications such as filtering and signal processing; fewer multipliers restrict parallel DSP throughput.
Maximum User I/O Pins 480 480 I/O count determines how many external interfaces and peripherals can be connected; identical counts support similar board-level connectivity.
Package FBGA-484 FBGA-484 Package compatibility is required for pin-to-pin replacement on an existing PCB; matching packages allow the same footprint.
Speed Grade 8 8 Speed grade affects maximum operating frequency and timing closure; identical grades mean comparable performance per logic path.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Temperature range defines the environments in which the device can reliably operate; matching ranges suit the same application conditions.
Core Supply Voltage 1.1 V 1.1 V Core voltage must match the board power design; identical values allow reuse of the same power delivery network.
Series / Family Cyclone V E Cyclone V E Same family ensures compatible architecture, IP cores, and toolchain support, simplifying migration between the two parts.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEBA2F23C8N 5CEBA7F23C8N
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 9434 56480
Number of Logic Elements/Cells 25000 149500
Total RAM Bits 2002944 7880704
Number of I/O 224 240
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the 5CEBA7F23C8N and 5CEBA2F23C8N devices?

Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs) in the 23 x 23 mm FBGA package with 484 pins, specified for commercial temperature range and speed grade 8. The 5CEBA7F23C8N offers a larger logic capacity than the 5CEBA2F23C8N within the same Cyclone V E family.

What is the main difference between the 5CEBA7F23C8N and 5CEBA2F23C8N?

The primary difference is logic density. The 5CEBA7F23C8N provides approximately 149,500 logic elements (LEs), while the 5CEBA2F23C8N provides approximately 25,000 LEs. This affects available adaptive logic modules, embedded memory, and DSP resources, but both share the same package, speed grade, and temperature grade.

Are the 5CEBA7F23C8N and 5CEBA2F23C8N pin-compatible?

Yes. Both devices are offered in the same 484-pin FBGA package (23 x 23 mm) with the same pinout for the Cyclone V E family. However, pin compatibility does not guarantee functional equivalence; designs must be recompiled and validated because the larger device may use additional I/O or transceiver resources.

Can the 5CEBA2F23C8N be used as a direct drop-in replacement for the 5CEBA7F23C8N?

No. Although the package and pinout are identical, the 5CEBA2F23C8N has significantly fewer logic elements, memory blocks, and DSP blocks. A design targeting the 5CEBA7F23C8N will not fit in the smaller device without redesign, resource reduction, or recompilation.

Do both devices support the same configuration methods?

Yes. Both 5CEBA7F23C8N and 5CEBA2F23C8N support standard Cyclone V configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration file sizes differ because of the different logic densities.

What are the typical operating conditions for these FPGAs?

Both devices are rated for commercial temperature range (0°C to 85°C junction temperature) and use a core voltage of 1.1 V with I/O voltages depending on bank configuration. Speed grade 8 indicates a specific timing performance level within the Cyclone V E family. Always verify exact supply and thermal requirements in the Intel Cyclone V device datasheet.

Which device should be selected for a new design?

Selection depends on logic utilization, memory, and DSP requirements. The 5CEBA2F23C8N is suitable for lower-density applications, while the 5CEBA7F23C8N supports larger designs. Both share the same package and speed grade, so migration between them is possible if the design fits and timing is revalidated.