Part A
5CEBA7F23C8N
インテル
- Lifecycle
- Active
- Stock
- 6287 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 5CEBA4U15C6N is not a drop-in replacement for the 5CEBA7F23C8N due to significant differences in logic density, package footprint, and speed grade, but it remains a viable functional candidate for lower-density applications where board space and cost are prioritized over maximum resource count.
Logic Density
Not compatible
Package Type
Not compatible
Speed Grade
Validation required
Supply Voltage
High match
Parts at a glance
Part B
5CEBA4U15C6N
インテル
- Lifecycle
- Active
- Stock
- 8629 個数
- Package
- LFBGA-324
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C8N | 5CEBA4U15C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain, IP, and pinout compatibility for migration. |
| Logic Elements (LE) | 150,000 | 49,000 | LE count determines available logic capacity; a large mismatch prevents direct functional substitution. |
| Embedded Memory (M10K) | 6,860 Kb | 3,080 Kb | On-chip memory limits buffering and storage; insufficient memory can break designs relying on larger RAM. |
| 18x18 Multipliers | 312 | 144 | DSP block count affects arithmetic throughput for signal processing and math-heavy logic. |
| Package | FBGA-484 | UBGA-324 | Different packages have different footprints and pin counts, preventing drop-in board replacement. |
| Speed Grade | 8 | 6 | Speed grade sets maximum operating frequency; a slower grade may not meet timing closure. |
| Operating Temperature | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature range must match the application environment for reliable operation. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage compatibility ensures the same power delivery design can be reused. |
| I/O Count | 224 | 176 | Available I/O pins constrain peripheral interfacing; fewer pins may not support the original design. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA7F23C8N | 5CEBA4U15C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 18480 |
| Number of Logic Elements/Cells | 149500 | 49000 |
| Total RAM Bits | 7880704 | 3464192 |
| Number of I/O | 240 | 176 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEBA7F23C8N and the 5CEBA4U15C6N?
The 5CEBA7F23C8N is a Cyclone V E FPGA with 150,000 logic elements in a 484-pin FBGA package, while the 5CEBA4U15C6N is a Cyclone V E FPGA with 49,000 logic elements in a 324-pin UBGA package. They differ in logic density, package type, pin count, and speed grade.
Are the 5CEBA7F23C8N and 5CEBA4U15C6N pin-to-pin compatible?
No. The 5CEBA7F23C8N uses a 484-pin FBGA package, and the 5CEBA4U15C6N uses a 324-pin UBGA package. The different package types, pin counts, and ball maps prevent direct pin-to-pin compatibility.
Can the 5CEBA4U15C6N be used as a direct drop-in replacement for the 5CEBA7F23C8N?
No. The two devices differ in logic element count, package footprint, pin count, and speed grade. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the design against the target device specifications.
What are the logic element counts for the 5CEBA7F23C8N and 5CEBA4U15C6N?
The 5CEBA7F23C8N contains 150,000 logic elements. The 5CEBA4U15C6N contains 49,000 logic elements. These values are specified in the Intel Cyclone V device family datasheet.
What package types do the 5CEBA7F23C8N and 5CEBA4U15C6N use?
The 5CEBA7F23C8N is offered in a 484-pin FBGA package. The 5CEBA4U15C6N is offered in a 324-pin UBGA package. Package dimensions and ball pitches differ between these two options.
What do the speed grade suffixes C8 and C6 indicate on these devices?
The C8 suffix on the 5CEBA7F23C8N indicates a commercial temperature grade with speed grade 8. The C6 suffix on the 5CEBA4U15C6N indicates a commercial temperature grade with speed grade 6. Speed grade 6 is faster than speed grade 8 in the Cyclone V family.
Do the 5CEBA7F23C8N and 5CEBA4U15C6N belong to the same FPGA family?
Yes. Both devices are members of the Intel Cyclone V E FPGA family. They share the same architecture and IP support but differ in logic density, package, and speed grade.
What should be verified before migrating a design from the 5CEBA7F23C8N to the 5CEBA4U15C6N?
Verify logic utilization fits within 49,000 logic elements, confirm all I/O pins and interfaces are available in the 324-pin UBGA package, check that timing closure is achievable with speed grade 6, and validate power supply and configuration requirements against the Cyclone V datasheet.