5CEFA9F27I7N vs 5CEFA2M13I7N

The 5CEFA9F27I7N and 5CEFA2M13I7N are both Intel (formerly Altera) Cyclone V F-series FPGAs, but they differ in logic density, package, and I/O count. The 5CEFA9F27I7N offers a larger logic array with 301,000 logic elements (LEs) in a 672-pin FBGA package (27 mm x 27 mm), while the 5CEFA2M13I7N provides 25,000 LEs in a 383-pin Micro FBGA package (13 mm x 13 mm). These differences affect available user I/O, memory resources, and suitable application complexity.

No. The 5CEFA9F27I7N uses a 672-pin FBGA package (F27) with a 27 mm x 27 mm body, while the 5CEFA2M13I7N uses a 383-pin Micro FBGA package (M13) with a 13 mm x 13 mm body. The package sizes, pin counts, and ball maps are different, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint without redesign.

No. A direct drop-in replacement is not possible because the two devices differ in package type, pin count, physical dimensions, logic capacity, and I/O resources. The 5CEFA9F27I7N has significantly more logic elements and user I/O than the 5CEFA2M13I7N. Any substitution would require a complete redesign of the PCB, power delivery, and configuration circuitry, followed by full design re-validation.

According to Intel Cyclone V device documentation, the 5CEFA9F27I7N contains 301,000 logic elements (LEs), while the 5CEFA2M13I7N contains 25,000 LEs. This roughly twelve-fold difference in logic density means the 5CEFA9F27I7N can implement substantially larger and more complex digital designs than the 5CEFA2M13I7N.

The 5CEFA9F27I7N is supplied in a 672-pin FBGA package with a 27 mm x 27 mm body (package code F27). The 5CEFA2M13I7N is supplied in a 383-pin Micro FBGA package with a 13 mm x 13 mm body (package code M13). The smaller Micro FBGA package of the 5CEFA2M13I7N makes it suitable for space-constrained designs, while the larger F27 package of the 5CEFA9F27I7N accommodates more I/O and power pins.

Both the 5CEFA9F27I7N and 5CEFA2M13I7N belong to the Intel Cyclone V F-series family and share the same configuration scheme options, including active serial, passive serial, and JTAG configuration. However, the number of available transceiver channels and high-speed interfaces differs by device density and package. The 5CEFA9F27I7N, with its larger package and higher logic count, supports more transceiver channels and I/O banks than the 5CEFA2M13I7N. Designers must consult the specific device pin-out files and transceiver channel maps for each part number.

The 5CEFA9F27I7N, with 301,000 LEs and a 672-pin package, is better suited for complex, high-bandwidth applications such as advanced image processing, high-performance computing acceleration, and multi-channel communication systems. The 5CEFA2M13I7N, with 25,000 LEs and a compact 13 mm x 13 mm package, is better suited for cost-sensitive, space-constrained designs such as portable devices, simple motor control, and basic interface bridging. Selection should be based on required logic capacity, I/O count, and board space.

Intel Cyclone V devices, including the 5CEFA9F27I7N and 5CEFA2M13I7N, are offered in lead-free, RoHS-compliant packages as standard. However, compliance status can vary by specific ordering code and date code. Designers should verify the RoHS and lead-free status for the exact part number and suffix on the manufacturer's product page or the distributor's environmental documentation before finalizing a design.