Part A
AM1802EZWTD3
STマイクロエレクトロニクス
- Lifecycle
- Active
- Stock
- 3390 個数
- Package
- NFBGA-361
- Series
- 組み込み - マイクロプロセッサ
Replacement verdict
Compatible functional replacement candidate
The AM1802EZWTD3 and AM1802BZCED3 are both Sitara AM1802 ARM926EJ-S application processors sharing the same core architecture, BGA package footprint, and industrial temperature range, making them strong functional replacement candidates. The primary distinction lies in their operating frequency grades, so system timing margins and clock configuration should be validated before substitution.
Core Architecture
High match
Package Type
High match
Operating Frequency
Validation required
Operating Temperature Range
High match
Parts at a glance
Part B
AM1802BZCED3
STマイクロエレクトロニクス
- Lifecycle
- Active
- Stock
- 6907 個数
- Package
- LFBGA-361
- Series
- 組み込み - マイクロプロセッサ
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1802EZWTD3 | AM1802BZCED3 | Why it matters |
|---|---|---|---|
| Package / Case | 361-LFBGA (16x16) | 361-NFBGA (13x13) | Different package footprints and ball maps prevent direct board-level drop-in replacement without a PCB redesign. |
| Operating Temperature Range | -40°C to +90°C (extended/industrial) | -40°C to +85°C (industrial) | The extended temperature variant supports higher ambient operating limits, which matters for thermally demanding or outdoor applications. |
| Core / CPU | ARM926EJ-S (ARM9) up to 300 MHz | ARM926EJ-S (ARM9) up to 300 MHz | Same ARM9 core and clock ceiling means identical instruction-set and performance characteristics for firmware compatibility. |
| On-Chip RAM | 8 KB ARM internal RAM + 128 KB on-chip RAM | 8 KB ARM internal RAM + 128 KB on-chip RAM | Identical internal memory resources ensure the same firmware memory map and buffer allocation behavior. |
| External Memory Interface | mDDR/DDR2, SDRAM, NAND/NOR flash, SRAM | mDDR/DDR2, SDRAM, NAND/NOR flash, SRAM | Matching memory controller support allows reuse of the same external memory subsystem and boot flash design. |
| Peripheral Set | USB 2.0 OTG, EMAC, UART, SPI, I2C, McASP, LCD controller, eHRPWM, eCAP | USB 2.0 OTG, EMAC, UART, SPI, I2C, McASP, LCD controller, eHRPWM, eCAP | Equivalent peripheral integration supports the same board-level I/O design and driver stack. |
| Supply Voltage (Core / I/O) | 1.2 V core / 1.8 V or 3.3 V I/O | 1.2 V core / 1.8 V or 3.3 V I/O | Same rail requirements allow reuse of the existing power supply and sequencing design. |
| Product Status / Longevity | Active (extended temp variant) | Active (industrial temp variant) | Both are active orderable variants, but the temperature-grade suffix determines which is appropriate for a given environmental spec. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | AM1802EZWTD3 | AM1802BZCED3 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 300MHz | 300MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| Ethernet | 10/100Mbps (1) | 10/100Mbps (1) |
| USB | USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | -40°C ~ 90°C (TJ) |
Frequently asked questions
What are the AM1802EZWTD3 and AM1802BZCED3?
Both are Sitara AM1802 ARM926EJ-S application processors from Texas Instruments. The AM1802EZWTD3 is supplied in a 361-ball NFBGA (ZWT) package, while the AM1802BZCED3 is supplied in a 361-ball NFBGA (ZCE) package. Both integrate an ARM926EJ-S core with 128 KB on-chip RAM and a range of peripherals including USB, EMAC, and LCD controller.
What is the difference between the ZWT and ZCE package suffixes?
The ZWT and ZCE suffixes denote different 361-ball NFBGA package variants defined by Texas Instruments. They differ in ball pitch and package body dimensions, which affects PCB land pattern and routing. Designers must use the specific package drawing for the ordered suffix rather than assuming interchangeability.
Do the AM1802EZWTD3 and AM1802BZCED3 have the same operating temperature range?
Both devices are specified for the industrial temperature range of -40°C to +90°C (case temperature), consistent with the "E" temperature designator in the part numbers. Thermal design should still be validated against the specific package's thermal resistance data in the datasheet.
Are the AM1802EZWTD3 and AM1802BZCED3 functionally identical?
Yes. Both are AM1802 devices sharing the same ARM926EJ-S core, memory map, and peripheral set. The differences are limited to package variant and associated mechanical/thermal characteristics, not the silicon functionality described in the AM1802 datasheet.
Can the AM1802EZWTD3 be used as a drop-in replacement for the AM1802BZCED3?
No. Because the ZWT and ZCE packages have different ball pitches and body dimensions, the PCB footprint and land pattern differ. A board designed for one package variant cannot accept the other without a layout change, even though the silicon functionality is the same.
What core and clock speed do these AM1802 devices support?
Both devices use an ARM926EJ-S core running at up to 375 MHz, as specified in the AM1802 datasheet. The core includes 16 KB instruction and 16 KB data caches, plus 128 KB of on-chip RAM shared with the ARM and peripherals.
Which peripherals are integrated in the AM1802EZWTD3 and AM1802BZCED3?
Both integrate USB 2.0 OTG, 10/100 Ethernet MAC (EMAC), an LCD controller, uPP, McASP, SPI, I2C, UART, and a 16-bit EMIFA external memory interface, per the AM1802 datasheet. Peripheral availability is identical between the two package variants.
How should I choose between the AM1802EZWTD3 and AM1802BZCED3 for a new design?
Selection should be based on package mechanical fit, PCB manufacturing capability for the specific ball pitch, thermal performance of the chosen package, and availability from authorized distributors. Confirm the exact package drawing and thermal data from the Texas Instruments datasheet for the ordered suffix before finalizing the layout.