AM1802EZWTD3 vs AM1806BZCEA3

AM1802EZWTD3とAM1806BZCEA3の詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The AM1806BZCEA3 is a viable functional replacement candidate for the AM1802EZWTD3, sharing the same ARM926EJ-S core architecture and comparable peripheral integration, though the differing package, speed grade, and operating temperature range require validation against the target application's mechanical and thermal requirements before substitution.

Core Architecture High match
Package Type Validation required
Operating Temperature Validation required
Max Clock Frequency Validation required

Parts at a glance

Part A

AM1802EZWTD3

STマイクロエレクトロニクス

Lifecycle
Active
Stock
3390 個数
Package
NFBGA-361
Series
組み込み - マイクロプロセッサ
Part B

AM1806BZCEA3

STマイクロエレクトロニクス

Lifecycle
Active
Stock
160 個数
Package
LFBGA-361
Series
組み込み - マイクロプロセッサ

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter AM1802EZWTD3 AM1806BZCEA3 Why it matters
Core Architecture ARM926EJ-S (ARM9) ARM926EJ-S (ARM9) Both use the same ARM9 core, so instruction set and toolchain compatibility are preserved.
Maximum Clock Frequency 300 MHz 456 MHz Higher clock speed in the AM1806 provides more processing headroom for compute-intensive tasks.
On-Chip RAM 8 KB 128 KB Larger on-chip RAM reduces external memory needs and improves performance for buffering and code execution.
Package / Pin Count 361-ball NFBGA (ZWT) 361-ball NFBGA (ZCE) Package footprint and ballout affect PCB layout and whether a drop-in replacement is possible.
Operating Temperature Range -40°C to +90°C (extended) -40°C to +85°C (industrial) Temperature range determines suitability for harsh or industrial environments.
USB Support USB 2.0 High-Speed OTG USB 2.0 High-Speed OTG Both support USB OTG, enabling host/device connectivity for peripherals and data transfer.
Ethernet MAC 10/100 Mbps EMAC 10/100 Mbps EMAC Integrated Ethernet MAC supports networked applications without external controllers.
LCD Controller Not available Integrated LCD controller The AM1806 can drive displays directly, while the AM1802 requires external display logic.
Supply Voltage (Core) 1.2 V 1.2 V Matching core voltage simplifies power supply design and compatibility.

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification AM1802EZWTD3 AM1806BZCEA3
Supplier - Rochester Electronics, LLC,Texas Instruments
Series Sitara™ Sitara™
Part Status Active Obsolete
Core Processor ARM926EJ-S ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 300MHz 375MHz
Co - Processors / DSP System Control; CP15 System Control; CP15
RAM Controllers LPDDR, DDR2 LPDDR, DDR2
Graphics Acceleration No No
Display&Interface Controllers LCD LCD
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Voltage - I / O 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 90°C (TJ) -40°C ~ 105°C (TJ)
Ethernet 10/100Mbps (1) -

Frequently asked questions

What are the key differences between the AM1802EZWTD3 and the AM1806BZCEA3?

The AM1802EZWTD3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZWT) package, while the AM1806BZCEA3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZCE) package. Both are members of the AM180x family, but they differ in package ball-out, operating temperature grade, and specific peripheral configuration. The AM1802EZWTD3 is specified for the extended commercial temperature range, whereas the AM1806BZCEA3 is specified for the industrial temperature range. Designers must consult the respective datasheets for exact peripheral and pin-mux differences.

Are the AM1802EZWTD3 and AM1806BZCEA3 pin-to-pin compatible?

No. Although both devices use a 361-ball NFBGA package, the AM1802EZWTD3 uses the ZWT ball-out and the AM1806BZCEA3 uses the ZCE ball-out. These are distinct package designators with different pin assignments and signal muxing, so they are not drop-in replacements. A PCB redesign or re-layout is required when migrating between them.

What is the operating temperature range of each device?

The AM1802EZWTD3 is rated for the extended commercial temperature range (typically 0°C to 90°C case temperature, per the AM180x datasheet). The AM1806BZCEA3 is rated for the industrial temperature range (typically -40°C to 90°C case temperature). The industrial-grade AM1806BZCEA3 is therefore the appropriate choice for applications exposed to sub-zero or harsh environments.

Do both devices use the same ARM core and clock speed?

Yes. Both the AM1802EZWTD3 and AM1806BZCEA3 integrate an ARM926EJ-S RISC core running at up to 375 MHz, with 16 KB instruction and 16 KB data caches, and both include the ARM ETM and embedded trace buffer for debug. Core architecture and maximum operating frequency are common across the two parts.

What memory and peripheral interfaces do these processors support?

Both devices provide a 16/32-bit DDR2/mDDR SDRAM controller, asynchronous EMIF (NOR/NAND), and a rich peripheral set including USB 2.0 OTG with integrated PHY, 10/100 Ethernet MAC, three UARTs, two SPI ports, two I2C ports, and an LCD controller. They also integrate an uPP (universal parallel port) and a 16-bit host-port interface. Exact channel counts and pin availability should be confirmed against the specific device datasheet because package ball-out affects which peripherals are bonded out.

Can I substitute the AM1806BZCEA3 for the AM1802EZWTD3 in an existing design?

Not directly. Because the two parts use different package ball-outs (ZWT vs ZCE), the PCB footprint and signal routing differ, so a direct substitution is not possible without a board redesign. Additionally, the AM1806BZCEA3 offers the wider industrial temperature range. Any migration must be validated against the manufacturer datasheets for pin mux, power sequencing, and peripheral availability.

Which device should I choose for an industrial application?

For industrial applications requiring operation below 0°C or in electrically noisy/harsh environments, the AM1806BZCEA3 is the appropriate choice because it is specified over the industrial temperature range (-40°C to 90°C case). The AM1802EZWTD3, rated for the extended commercial range, is better suited to controlled-environment consumer or commercial designs. Final selection should also account for package ball-out and peripheral requirements.