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CSD95490Q5MC
+BOMPOWERSTAGE
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メーカーSTマイクロエレクトロニクス
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メーカー品番 #CSD95490Q5MC
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パッケージ VSON-CLIP-12
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在庫状況2844
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge (3) |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| LoadType | Inductive, Capacitive |
| Technology | Power MOSFET |
| Current-Output/Channel | 75A |
| Current-PeakOutput | 105A |
| Voltage-Supply | 4.5V ~ 5.5V |
| Voltage-Load | 4.5V ~ 16V |
| OperatingTemperature | -40°C ~ 125°C (TJ) |
| Features | Bootstrap Circuit |
| FaultProtection | Shoot-Through |
| MountingType | Surface Mount |
| Package/Case | 12-PowerTFDFN |
概要
Description
Key features include high-frequency operation, reduced parasitic inductance, and optimized switching performance, which contribute to its high power density and efficient thermal management. The CSD95490Q5MC supports fast switching frequencies, enabling smaller output inductors and capacitors, thus minimizing the overall size of power solutions. It also features a current-sense output for overcurrent protection and monitoring.
The device is designed to work seamlessly with TI’s NexFET technology, enhancing performance in high-current applications. It comes in a 5x6 mm QFN package, making it suitable for applications where space and efficiency are critical. Overall, the CSD95490Q5MC is ideal for engineers looking to design compact, energy-efficient power management systems.
Equivalent
Features
1. Integrated MOSFETs: It combines high-side and low-side MOSFETs for efficient power management.
2. High Efficiency: Designed for high-speed switching applications, offering superior efficiency.
3. Compact Package: Comes in a compact 5 mm x 6 mm QFN package, optimizing board space.
4. Thermal Performance: Enhanced thermal performance due to optimized MOSFET driver and package design.
5. Smart Protection: Features include over-temperature protection, under-voltage lockout, and shoot-through protection.
6. High Switching Frequency: Capable of operating at high frequencies, reducing the size of external components.
7. Low Parasitics: Integrated design minimizes parasitic inductance and resistance.
8. Power Loss Reduction: Advanced MOSFET technology reduces power losses.
These features make the CSD95490Q5MC suitable for applications in computing, server, and telecom infrastructure where efficient power conversion is essential.
Pinout
The CSD95490Q5MC comes in a 40-pin QFN package. Here is a concise overview of its pin functions:
- PVIN: Power input for the high-side MOSFET.
- VIN: Input voltage for the driver IC.
- VOUT: Output voltage from the power stage.
- PGND: Power ground connection.
- GND: Ground for the driver IC.
- BOOT: Bootstrap capacitor connection.
- SW: Switch node, connects the high-side and low-side MOSFETs.
- PWM: Receives PWM signal to control switching.
- EN: Enable pin to turn the device on or off.
- VDRV: Supplies voltage for the internal driver circuit.
This integrated power stage is designed for high efficiency and compact designs, reducing board space and component count. Always refer to the datasheet for detailed specifications and pin configurations.
Manufacturer
Application
1. Servers and Data Centers: For efficient power management and distribution.
2. Telecommunications: Used in base stations and network equipment for stable power delivery.
3. Graphics Cards and Gaming Consoles: To support high power requirements of GPUs.
4. Consumer Electronics: In devices like laptops and tablets for increased battery life.
5. Industrial Power Supplies: For reliable power conversion in various industrial applications.
Its compact size and high efficiency make it ideal for applications where space and thermal performance are critical.