K4AAG165WB-MCRC

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K4AAG165WB-MCRC

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FBGA-96 Memory (ICs) RoHS

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  • メーカー品番 #K4AAG165WB-MCRC

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仕様

属性 値
Packaging FBGA-96

概要

Equivalent

The K4AAG165WB-MCRC is a 16Gb DDR4 SDRAM chip by Samsung. Equivalent alternatives include:
- SK Hynix: H5ANAG8NMR-X (e.g., H5ANAG8NMJR-X)
- Micron: MT40A1G16X-XX (e.g., MT40A1G16TB-062E)
- Nanya: NT5AD1024M16A4-X
Ensure compatibility with voltage (1.2V), speed (e.g., 2666/3200 Mbps), and package (96-ball FBGA). Verify datasheets for exact replacements.

Features

The K4AAG165WB-MCRC is a 16Gb (2GB) DDR4 SDRAM module from Samsung, designed for high-performance applications. Key features include:
- Capacity: 16Gb (2GB)
- Speed: 2133 Mbps (DDR4-2133)
- Voltage: 1.2V (low power)
- Organization: 2G x 8 (x8 configuration)
- CAS Latency (CL): 15
- Form Factor: 260-pin SODIMM (for laptops/embedded systems)
- Density: Single-rank
- Operating Temp: Commercial (0°C to 95°C)
- Features: On-die ECC (for reliability), JEDEC-compliant
Ideal for notebooks, embedded systems, and industrial applications requiring efficient, low-power DDR4 memory.

Manufacturer

The K4AAG165WB-MCRC is a DDR4 SDRAM module manufactured by SK Hynix, a South Korean semiconductor company.
SK Hynix is a major global producer of memory chips, specializing in DRAM, NAND flash, and other semiconductor solutions. It is one of the largest memory suppliers worldwide, competing with companies like Samsung and Micron. The company supplies components for various applications, including consumer electronics, servers, and automotive systems.
The part number indicates a 16Gb (gigabit) DDR4 chip with specific speed and configuration details. SK Hynix is known for its high-performance memory products used in PCs, data centers, and mobile devices.

Application

The K4AAG165WB-MCRC is a DDR4 SDRAM module from Samsung, primarily used in:
- Data centers & servers (high-speed, reliable memory for cloud computing)
- Enterprise storage systems (enhancing performance in NAS/SAN)
- Networking equipment (routers, switches for efficient data handling)
- High-performance computing (HPC) (AI/ML workloads, scientific simulations)
- Industrial applications (robust memory for embedded systems)
It offers 16Gb density, 2666Mbps speed, and ECC support, making it ideal for stability-critical environments.

Package

The K4AAG165WB-MCRC is a FBGA (Fine-Pitch Ball Grid Array) package. It's a 96-ball BGA with dimensions of 9mm x 14mm, commonly used for DDR4 SDRAM modules. The package supports high-speed data transfer and is designed for compact, high-performance applications.

Frequently Asked Questions


Q: What is the memory type and configuration of the K4AAG165WB-MCRC?
A: It is a Samsung DDR4 SDRAM, typically organized as 16Gb (1G x 16) in a 96-ball FBGA package, suitable for high-density computing.


Q: What is the operating voltage range for this DRAM component?
A: As a DDR4 device, it operates at a standard 1.2V nominal voltage, reducing power consumption compared to DDR3.


Q: Is this component RoHS compliant and lead-free?
A: While the parameter lists RoHS as "-", Samsung DDR4 components generally meet RoHS standards. Confirm with official datasheet for precise certification.


Q: What are the typical speed grades for the K4AAG165WB-MCRC?
A: This part typically supports DDR4-3200 data rates, offering high bandwidth for applications like servers and networking equipment.


Q: Can this memory be used in industrial temperature range environments?
A: The lifecycle status is not specified; verify if this specific suffix supports -40°C to +85°C industrial grade, as standard is 0°C to +85°C.


Q: What is the pin layout and footprint for the FBGA-96 package?
A: It uses a standard JEDEC 96-ball FBGA package, with a 0.8mm ball pitch, compatible with common DDR4 layouts for PCB design.


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