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MT29F64G08AECDBJ4-6ITR:D

Name: MT29F64G08AECDBJ4-6ITR:D
Rating: 4.8 (15 reviews)

+BOM

IC FLASH 64GBIT PAR 132VBGA

メーカーマイクロンテクノロジー株式会社
メーカー品番 #MT29F64G08AECDBJ4-6ITR:D
在庫状況6738

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性	値
Part Status	Obsolete
Base Product Number	MT29F64G08
Digi Key Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NAND
Memory Size	64Gbit
Memory Organization	8G x 8
Memory Interface	Parallel
Clock Frequency	166 MHz
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	132-VBGA
Supplier Device Package	132-VBGA (12x18)
Packaging	Tray

概要

Description

The MT29F64G08AECDBJ4-6ITR:D is a 64 Gb (gigabit) NAND flash memory device produced by Micron Technology. It is designed for high-density storage applications, commonly utilized in consumer electronics, mobile devices, and industrial applications. The device features a 3D NAND architecture, enhancing performance and endurance compared to traditional 2D NAND.
Key specifications include:
- Storage Capacity: 64 Gb (8 GB)
- Interface: ONFi (Open NAND Flash Interface) compliant for compatibility with various controllers.
- Access Times: Fast read and write cycle times, improving data transfer speeds.
- Endurance: Designed for high program/erase cycles, ensuring reliability over time.
- Form Factor: Available in a compact package suitable for space-constrained applications.
The suffix "D" typically indicates a specific variant or feature set within Micron’s product line. This device is utilized in applications where high data retention and efficient power usage are crucial.

Equivalent

The MT29F64G08AECDBJ4-6ITR:D chip is a 64Gb NAND Flash memory chip. Equivalent products include:
1. Samsung K9GAG08U0E (64Gb)
2. Micron MT29F64G08CBABA
3. Hynix H26M64003GTR (64Gb)
4. Toshiba TH58NVG7D2KBA
Always verify compatibility based on specific application requirements and pin configurations.

Features

The MT29F64G08AECDBJ4-6ITR:D is a NAND Flash memory chip manufactured by Micron Technology. It features a 64Gb (Gigabit) capacity, organized in a 16-bit interface, allowing for efficient data transfer and storage. Key features include:
1. Technology: 3D NAND technology, enhancing performance and endurance.
2. Interface: Supports ONFI 4.1, enabling faster read/write speeds.
3. Performance: Offers high-speed read (up to 400 MB/s) and write operations, making it suitable for various applications.
4. Endurance: Designed for high endurance, featuring a typical program/erase cycle of around 3,000 cycles.
5. Low Power Consumption: Enhanced power efficiency, ideal for mobile and portable devices.
6. Temperature Range: Operates over a wide temperature range, supporting diverse environmental conditions.
7. Form Factor: Available in multiple packages, including TSOP and BGA.
This device is ideal for applications like smartphones, tablets, and other consumer electronics that require reliable and high-capacity storage solutions.

Pinout

The MT29F64G08AECDBJ4-6ITR:D is a NAND flash memory device with a pin count of 48 pins.
### Pin Functions:
1. Power Supply Pins:
- VCC: Power supply for the device.
- VSS: Ground reference.
2. Control Pins:
- CE#: Chip Enable (activates the chip).
- RE#: Read Enable (controls read operations).
- WE#: Write Enable (controls write operations).
- R/B#: Ready/Busy indicator.
3. Data Pins:
- I/O0 to I/O7: Bidirectional data input/output pins.
4. Address Pins:
- A0 to A17: Address inputs for selecting memory pages and blocks.
5. Other Pins:
- WP#: Write Protect (prevents write operations when asserted).
- TBL: Toggle for additional control.
This device features a 64Gb (8GB) capacity and is typically used in various applications, including mobile devices and SSDs.

Manufacturer

The manufacturer of the MT29F64G08AECDBJ4-6ITR:D is Micron Technology, Inc. Micron is a leading American manufacturer of semiconductor devices, specializing in memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, the company produces a wide range of products, including DRAM, NAND flash memory, and solid-state drives (SSDs). Micron serves various markets, such as consumer electronics, automotive, industrial, and data centers, contributing to advancements in technology through innovative memory solutions.

Application

The MT29F64G08AECDBJ4-6ITR:D is a NAND flash memory device primarily used in applications such as smartphones, tablets, and other mobile devices for data storage. It is also suitable for use in automotive systems, industrial equipment, and consumer electronics. The device's high storage capacity and reliability make it ideal for solid-state drives (SSDs), embedded storage solutions, and memory expansion in various electronic devices. Its fast read/write speeds enhance performance in applications requiring quick data access and data-intensive tasks.

Package

The MT29F64G08AECDBJ4-6ITR:D is a NAND flash memory device from Micron, packaged in a 48-ball BGA (Ball Grid Array) format. This surface-mount package type is designed for high-density applications, offering efficient thermal performance and space-saving benefits.

Frequently Asked Questions

Q: What is the memory density and organization of the MT29F64G08AECDBJ4-6ITR?
A: It has a 64Gbit density organized as 8G x 8, suitable for high-density code or data storage in embedded systems.

Q: Does this component support a parallel interface for legacy designs?
A: Yes, it uses a parallel NAND Flash memory interface, compatible with traditional memory controllers and SoC designs.

Q: What is the operating temperature range for this NAND Flash?
A: It operates from -40°C to 85°C (TA), making it suitable for industrial and harsh environment applications.

Q: What is the maximum clock frequency for read/write operations?
A: The device supports a clock frequency of up to 166 MHz, enabling fast data transfer rates in parallel mode.

Q: What voltage supply range is required for this Flash memory?
A: It requires a supply voltage range of 2.7V to 3.6V, compatible with standard 3.3V logic systems.

Q: Can this part be used in new designs given its obsolete status?
A: Due to its "Obsolete" lifecycle status, it is recommended for legacy product support or last-time buy; not for new designs.

Q: What is the package type and size for this NAND Flash IC?
A: It is housed in a 132-VBGA package (12x18mm), a surface-mount BGA ideal for space-constrained PCB layouts.