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MT40A2G16SKL-062E:B
+BOMIC DRAM 32GBIT PARALLEL 96FBGA
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メーカーマイクロンテクノロジー株式会社
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メーカー品番 #MT40A2G16SKL-062E:B
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在庫状況4233
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | TwinDie™ |
| Part Status | Obsolete |
| Base Product Number | MT40A2G16 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR4 |
| Memory Size | 32Gbit |
| Memory Organization | 2G x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 1.6 GHz |
| Voltage - Supply | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 96-TFBGA |
| Supplier Device Package | 96-FBGA (10.5x13) |
| Packaging | Tray |
| Access Time | 13.75 ns |
概要
Description
This DRAM module operates at a voltage of 1.2V, which aligns with the standard for DDR4 memory, ensuring energy efficiency and reduced power consumption compared to previous DDR versions. The "062E" in the model number typically indicates specific timing and speed characteristics, though precise details would depend on Micron's official datasheets.
The MT40A2G16SKL-062E:B is commonly used in servers, desktops, and other systems that prioritize speed and reliability, benefiting from DDR4's advanced features like improved bandwidth and lower latency. Its design supports faster data transfer rates, making it ideal for modern applications requiring substantial memory throughput and quick response times.
Equivalent
1. Samsung K4A8G165WB-BCRC: A 16Gb DDR4 SDRAM.
2. Hynix H5AN8G6NCJ: A 16Gb DDR4 SDRAM.
3. Kingston D4AG16C9FB19: A 16Gb DDR4 SDRAM.
These equivalents share similar specifications such as density, speed, and form factor, but always confirm compatibility with your specific application requirements.
Features
1. Density and Configuration: It has a 2Gb density and uses a x16 configuration, which makes it suitable for high-density memory applications.
2. Speed and Performance: The module operates at a speed of 3200 MT/s (megatransfers per second), providing fast data transfer rates.
3. Voltage: It requires a voltage of 1.2V, which is typical for DDR4 modules, offering a balance between performance and power efficiency.
4. Package Type: The module comes in a FBGA (Fine Ball Grid Array) package, ensuring reliable and compact mounting on circuit boards.
5. Temperature Range: It supports a standard operating temperature range, making it suitable for various applications.
6. Error Correction: It features on-die ECC (Error Correction Code), which helps improve data integrity by detecting and correcting errors within the chip itself.
These attributes make the MT40A2G16SKL-062E:B well-suited for computing environments that require efficient memory solutions.
Pinout
Key functions of this DRAM include:
- High-speed data transfer capabilities, typical of DDR4 memory technology.
- Support for various memory functions such as auto precharge, power-down, and self-refresh modes.
- Internal VREF (reference voltage) support for improved signal integrity.
- On-die termination (ODT) to enhance performance by minimizing reflections and noise on data lines.
- Consistent with DDR4, it offers features like bank group architecture and data bus inversion (DBI).
The MT40A2G16SKL-062E:B is utilized in environments requiring efficient, high-speed memory operations, such as in computing, networking, and high-performance electronics.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory capacity and organization of the MT40A2G16SKL-062E:B?
A: It has a 32Gbit density organized as 2G x 16, suitable for high-density memory applications.
Q: What is the clock frequency and access time of this DDR4 SDRAM?
A: The clock frequency is 1.6 GHz, with an access time of 13.75 ns, ensuring high-speed data transfer.
Q: What voltage range does this component require for operation?
A: It operates at a supply voltage of 1.14V to 1.26V, compliant with DDR4 standards.
Q: What is the operating temperature range for this DRAM?
A: It operates from 0°C to 95°C (TC), suitable for commercial and industrial environments.
Q: Is this memory component surface-mountable and what package does it use?
A: Yes, it is surface mount in a 96-TFBGA package, with a supplier device package of 96-FBGA (10.5x13).
Q: What is the memory interface and format of this device?
A: It uses a parallel memory interface and is non-volatile DRAM with SDRAM - DDR4 technology.
Q: Why is this part listed as "Obsolete" and should I consider alternatives?
A: It is marked Obsolete, meaning Micron no longer produces it; evaluate alternatives with similar specifications for new designs.