画像は参考用です
MTFC32GBCAQTC-WT
+BOMEMMC 256GBIT 153/196 LFBGA WT
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メーカーマイクロンテクノロジー株式会社
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メーカー品番 #MTFC32GBCAQTC-WT
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在庫状況4788
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | e•MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 256Gbit |
| Memory Organization | 32G x 8 |
| Memory Interface | eMMC_5.1 |
| Clock Frequency | 200 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -25°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package | 153-LFBGA |
| Supplier Device Package | 153-LFBGA (11.5x13) |
| Packaging | Bulk |
概要
Description
MTFC32GBCAQTC-WT looks like a part number for a 32 GB flash memory device. Without the vendor or datasheet, I can only give a generic intro: it’s a non-volatile storage component used in embedded systems to hold firmware and data. Typical specs to confirm are memory type (NAND vs NOR), interface (SPI, ONFi, SATA, etc.), operating voltage, endurance, read/write speeds, package type, and temperature rating (WT often suggests a wide-temperature variant). For an accurate introduction, please share the manufacturer or a datasheet link.
Manufacturer
Manufacturer: Micron Technology, Inc.
What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures memory and storage technologies, including DRAM, NAND/NOR flash, and SSDs. They are one of the largest memory chip producers worldwide.
What kind of company: A U.S.-based multinational semiconductor company that designs and manufactures memory and storage technologies, including DRAM, NAND/NOR flash, and SSDs. They are one of the largest memory chip producers worldwide.
Application
Typically used as onboard nonvolatile storage in systems needing compact capacity and rugged operation:
- Embedded devices (MCUs/SoCs) requiring firmware and data storage
- Automotive (infotainment, instrument clusters, telematics)
- Industrial automation and control systems
- Consumer electronics (set-top boxes, streaming devices, cameras)
- Networking/telecom equipment (routers, gateways, APs)
- IoT edge devices and gateways
- Digital signage and surveillance systems
- Medical devices for firmware/data logging (noncritical)
Note: Refer to the official datasheet for interface, endurance and temperature specifications.
- Embedded devices (MCUs/SoCs) requiring firmware and data storage
- Automotive (infotainment, instrument clusters, telematics)
- Industrial automation and control systems
- Consumer electronics (set-top boxes, streaming devices, cameras)
- Networking/telecom equipment (routers, gateways, APs)
- IoT edge devices and gateways
- Digital signage and surveillance systems
- Medical devices for firmware/data logging (noncritical)
Note: Refer to the official datasheet for interface, endurance and temperature specifications.
Package
Package type: BGA (Ball Grid Array). For exact ball count and footprint, consult the manufacturer’s MTFC32GBCAQTC-WT datasheet.
